Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AR | P10275 | 2/20 | 0.53 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.37 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.36 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.36 |
| ▸ | CNR2 | P34972 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.33 |
| ▸ | TPH1 | P17752 | 1/20 | 0.33 |
| ▸ | PSMD14 | O00487 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | RECQL | P46063 | 1/20 | 0.33 |
| ▸ | GFER | P55789 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.33 |
| ▸ | DRD2 | P14416 | 1/20 | 0.33 |
| ▸ | DRD1 | P21728 | 1/20 | 0.33 |
| ▸ | DRD3 | P35462 | 1/20 | 0.33 |
| ▸ | ALDH1A3 | P47895 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8364929 | 0.87 | AR (0.48) | ARTSHRCNR2L3MBTL1PTPN1 | |
| SCHEMBL462452 | 0.86 | AR (0.49) | ARTSHRGABRA1GABRB2CNR2 | |
| Hydrochloric Acid SCHEMBL5510044 | 0.84 | AR (0.47) | ARTSHRGABRA1GABRB2CNR2 | |
| Hydrochloric Acid SCHEMBL31500442 | 0.84 | AR (0.47) | ARTSHRGABRA1GABRB2CNR2 | |
| SCHEMBL8740852 | 0.82 | AR (0.43) | ARTSHRCNR2ALDH1A1CYP3A4 | |
| SCHEMBL14758687 | 0.82 | AR (0.43) | ARTSHRCNR2ALDH1A1CYP3A4 | |
| SCHEMBL5317695 | 0.82 | AR (0.46) | ARTSHRGABRA1GABRB2ALDH1A1 | |
| SCHEMBL3241603 | 0.82 | AR (0.43) | ARTSHRCNR2ALDH1A1CYP3A4 | |
| SCHEMBL814319 | 0.82 | HTR1A (0.40) | ARHSPA5GABRA1GABRB2ALDH1A1 | |
| SCHEMBL7674635 | 0.82 | AR (0.46) | ARTSHRGABRA1GABRB2CNR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11407895-B2 | Resin composition and article made therefrom | Elite Material Co., Ltd. (TW) | 2022-08-09 | — | — | US | claimed |
| US-20210371655-A1 | RESIN COMPOSITION AND ARTICLE MADE THEREFROM | Elite Material Co., Ltd. (TW) | 2021-12-02 | — | — | US | claimed |
| EP-2247452-B1 | POLYURETHANE ELASTOMER ARTICLES FROM LOW FREE DIPHENYLMETHANE DIISOCYANATE PREPOLYMERS | CHEMTURA CORP (US) | 2011-06-29 | — | — | EP | claimed |
| US-20260015455-A1 | EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME | TORAY INDUSTRIES, INC. (JP) | 2026-01-15 | — | — | US | disclosed |
| EP-4674884-A1 | EPOXY RESIN COMPOSITION FOR RTM, CURED RESIN PRODUCT AND FIBER-REINFORCED COMPOSITE MATERIAL, AND MANUFACTURING METHOD THEREFOR | Toray Industries, Inc. (JP) | 2026-01-07 | — | — | EP | disclosed |
| EP-4495156-A1 | EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME | Toray Industries, Inc. (JP) | 2025-01-22 | — | — | EP | disclosed |
| WO-2024181251-A1 | EPOXY RESIN COMPOSITION FOR RTM, CURED RESIN PRODUCT AND FIBER-REINFORCED COMPOSITE MATERIAL, AND MANUFACTURING METHOD THEREFOR | 東レ株式会社 | 2024-09-06 | — | — | WO | disclosed |
| US-11827789-B2 | Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof | RESONAC CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| WO-2023176935-A1 | EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME | 東レ株式会社 | 2023-09-21 | — | — | WO | disclosed |
| US-11553593-B2 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| US-11407895-B2 | Resin composition and article made therefrom | Elite Material Co., Ltd. (TW) | 2022-08-09 | — | — | US | disclosed |
| US-20070071984-A1 | Substrate for flexible printed wiring board and method for manufacturing the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-03-29 | — | — | US | disclosed |
| US-20070026227-A1 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060135706-A1 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles | CITIBANK, N.A., AS COLLATERAL AGENT | 2006-06-22 | — | — | US | disclosed |
| EP-1666556-A1 | ADHESIVE AID COMPOSITION | Nippon Kayaku Kabushiki Kaisha (JP) | 2006-06-07 | — | — | EP | disclosed |
| EP-1667501-A1 | SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | UNITIKA LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |
| US-7022777-B2 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles | GENERAL ELECTRIC (US) | 2006-04-04 | — | — | US | disclosed |
| EP-1409588-A2 | MOLDABLE POLY(ARYLENE ETHER) THERMOSETTING COMPOSITIONS, METHODS, AND ARTICLES | GENERAL ELECTRIC COMPANY (US) | 2004-04-21 | — | — | EP | disclosed |
| US-20030018131-A1 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles | CITIBANK, N.A., AS COLLATERAL AGENT | 2003-01-23 | — | — | US | disclosed |
| WO-2003002667-A2 | MOLDABLE POLY(ARYLENE ETHER) THERMOSETTING COMPOSITIONS, METHODS, AND ARTICLES | GENERAL ELECTRIC COMPANY (US) | 2003-01-09 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260015455-A1 | EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME | RFT1, RER1, TERB1 | AR 594/4885TSHR 3095/4885HSPA5 1333/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.