SCHEMBL12418952

SCHEMBL12418952

COCc1cc(C)cc(Cc2cc(C)cc(CCO)c2O)c1O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.46
CYP2C9 P11712 2/20 0.45
CYP2C19 P33261 2/20 0.45
HIF1A Q16665 2/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
HSPA5 P11021 1/20 0.42
HSD17B10 Q99714 2/20 0.41
CYP2D6 P10635 1/20 0.41
PRKCE Q02156 3/20 0.40
ALDH1A1 P00352 3/20 0.40
MYLK Q15746 2/20 0.40
MEN1 O00255 1/20 0.40
PRKCG P05129 1/20 0.40
MAPT P10636 1/20 0.40
PRKCA P17252 1/20 0.40
APEX1 P27695 1/20 0.40
RECQL P46063 1/20 0.40
KMT2A Q03164 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
SHBG P04278 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19600593 1.00 AMY1A (0.46) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL10114746 0.95 PRKCE (0.43) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL210222 0.89 AMY1A (0.55) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL16850513 0.89 AMY1A (0.55) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL14490998 0.88 AMY1A (0.57) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL22222032 0.86 AMY1A (0.49) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL19421993 0.84 AMY1A (0.50) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL2115983 0.84 ALDH1A1 (0.52) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL16207219 0.83 SHBG (0.46) CYP2D6PRKCEALDH1A1MYLKMEN1
SCHEMBL15436831 0.83 AMY1A (0.49) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed
US-8758977-B2 Negative-type photosensitive resin composition, pattern forming method and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-06-24 US disclosed
US-20110171436-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2011-07-14 US disclosed