Fluoride Ion

Fluoride Ion

SCHEMBL124206

COc1ccc(C[N+](C)(C)c2ccc(C)cc2)cc1.[F-].[F-].[F-].[F-].[F-].[F-].[Sb+3]

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ACHE P22303 4/20 0.50
MAPT P10636 2/20 0.44
RELA Q04206 1/20 0.42
ALDH1A1 P00352 2/20 0.41
BCHE P06276 1/20 0.41
EGFR P00533 1/20 0.40
IDO1 P14902 1/20 0.40
ALOX5 P09917 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.39
KDM4E B2RXH2 1/20 0.39
ALOX15 P16050 1/20 0.39
MEN1 O00255 1/20 0.38
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
KMT2A Q03164 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26197514 0.97 ACHE (0.54) ACHEMAPTRELAALDH1A1BCHE
Fluoride Ion SCHEMBL4075058 0.85 LTA4H (0.52) ACHEEGFRIDO1
SCHEMBL26948991 0.84 IDO1 (0.42) ACHEMAPTALDH1A1BCHEIDO1
Trifluoromethanesulfonic Acid SCHEMBL2334073 0.82 ALDH1A1 (0.45) ACHEMAPTALDH1A1BCHEEGFR
SCHEMBL565171 0.81 LTA4H (0.55) ACHEIDO1
SCHEMBL27121989 0.81 LTA4H (0.55) ACHEMAPTALDH1A1SMN1; SMN2KDM4E
Fluoride Ion SCHEMBL127552 0.81 ACHE (0.47) ACHEMAPTRELAALDH1A1BCHE
SCHEMBL2289588 0.79 LTA4H (0.58) ACHEALDH1A1IDO1KDM4ENPC1
Hydrochloric Acid SCHEMBL6277766 0.79 LTA4H (0.53) ACHEALDH1A1IDO1KDM4E
Fluoride Ion SCHEMBL4072236 0.79 ALDH1A1 (0.47) ACHEMAPTALDH1A1BCHESMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5556927-A FILMS, COATINGS, REACTION OF EPOXY RESIN OR LACTONE MODIFIED EPOXY RESIN WITH CYCLIC CARBONATE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-17 US claimed
WO-2024122416-A1 METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
EP-4289618-A1 UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME Toagosei Co., Ltd. (JP) 2023-12-13 EP disclosed
US-20220186066-A1 PROTECTION MEMBER FOR SEMICONDUCTOR, PROTECTION COMPOSITION FOR INKJET COATING-TYPE SEMICONDUCTOR, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS USING SAME, AND SEMICONDUCTOR APPARATUS MITSUI CHEMICALS, INC. (JP) 2022-06-16 US disclosed
US-9136486-B2 Composition for organic semiconductor insulating films, and organic semiconductor insulating film TOAGOSEI CO., LTD. (JP) 2015-09-15 US disclosed
US-8987344-B2 Hardcoat composition MITSUI CHEMICALS, INC. (JP) 2015-03-24 US disclosed
US-20140326980-A1 COMPOSITION FOR ORGANIC SEMICONDUCTOR INSULATING FILMS, AND ORGANIC SEMICONDUCTOR INSULATING FILM TOAGOSEI CO., LTD. (JP) 2014-11-06 US disclosed
EP-2108027-B1 HARDCOAT COMPOSITION MITSUI CHEMICALS INC (JP) 2012-03-07 EP disclosed
US-7709553-B2 Photo cation polymerizable resin composition and surface protective material for optical disk MITSUI CHEMICALS, INC. (JP) 2010-05-04 US disclosed
WO-2008087741-A1 HARDCOAT COMPOSITION MITSUI CHEMICALS, INC. (JP) 2008-07-24 WO disclosed
US-20070037896-A1 polymerizable resin composition comprises an epoxy compound, a photo cation polymerization initiator, and a photo radical polymerization initiator; excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage; surface protective material for optical disks MITSUI CHEMICALS, INC. (JP) 2007-02-15 US disclosed
EP-1630189-A1 CATIONICALLY PHOTOPOLYMERIZABLE RESIN COMPOSITION AND OPTICAL DISK SURFACE PROTECTION MATERIAL Mitsui Chemicals, Inc. (JP) 2006-03-01 EP disclosed
US-6395340-B1 THERMOSETTING PAINT KANSAI PAINT CO., LTD. (JP) 2002-05-28 US disclosed
EP-1038935-A1 COATING COMPOSITION AND METHOD FOR COATING THEREWITH KANSAI PAINT CO., LTD. (JP) 2000-09-27 EP disclosed
EP-1026211-A1 COATING COMPOSITION AND METHOD FOR APPLYING THE SAME KANSAI PAINT CO., LTD. (JP) 2000-08-09 EP disclosed
EP-0687697-B1 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEM (JP) 2000-05-03 EP disclosed
US-5733982-A CURABLE COMPOSITIONS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-03-31 US disclosed
US-5556927-A FILMS, COATINGS, REACTION OF EPOXY RESIN OR LACTONE MODIFIED EPOXY RESIN WITH CYCLIC CARBONATE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-17 US disclosed
EP-0687697-A2 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1995-12-20 EP disclosed