Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 2/20 | 0.55 |
| ▸ | ACHE | P22303 | 4/20 | 0.47 |
| ▸ | CA4 | P22748 | 1/20 | 0.46 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.46 |
| ▸ | IDO1 | P14902 | 2/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.44 |
| ▸ | USP2 | O75604 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | AGXT | P21549 | 1/20 | 0.41 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2289588 | 0.98 | LTA4H (0.58) | LTA4HACHECA4SIGMAR1IDO1 | |
| Hydrochloric Acid SCHEMBL6277766 | 0.98 | LTA4H (0.53) | LTA4HACHECA4SIGMAR1IDO1 | |
| Fluoride Ion SCHEMBL4075058 | 0.96 | LTA4H (0.52) | LTA4HACHECA4SIGMAR1IDO1 | |
| SCHEMBL23069371 | 0.93 | LTA4H (0.49) | LTA4HACHECA4SIGMAR1IDO1 | |
| SCHEMBL21747569 | 0.93 | LTA4H (0.49) | LTA4HACHECA4SIGMAR1IDO1 | |
| SCHEMBL27121989 | 0.93 | LTA4H (0.55) | LTA4HACHECA4SIGMAR1HTT | |
| SCHEMBL3384399 | 0.88 | LTA4H (0.44) | LTA4HACHECA4SIGMAR1HTT | |
| SCHEMBL21747544 | 0.85 | LTA4H (0.41) | LTA4HACHECA4SIGMAR1IDO1 | |
| Trifluoromethanesulfonic Acid SCHEMBL565735 | 0.84 | HTT (0.43) | LTA4HACHEHTT | |
| Trifluoromethanesulfonic Acid SCHEMBL1269460 | 0.84 | ACHE (0.43) | LTA4HACHEHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103154081-B | For the polymer composition of microelectronics assewbly part | PROMERUS, LLC (US) | 2015-11-25 | — | — | CN | claimed |
| EP-1917316-B1 | COATING MASS | ALTANA ELEC INSULATION GMBH (DE) | 2010-12-01 | — | — | EP | claimed |
| EP-1497079-B1 | COATED ABRASIVE ARTICLE, METHOD FOR MAKING THE SAME AND METHODS OF ABRADING A WORKPIECE | 3M INNOVATIVE PROPERTIES CO (US) | 2008-05-21 | — | — | EP | claimed |
| WO-2025107100-A1 | EPOXY ADHESIVE INCLUDING POLYMERIC TOUGHENER AND CATIONIC PHOTOINITIATOR AND METHOD FOR USING SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2025-05-30 | — | — | WO | disclosed |
| WO-2025108217-A1 | EPOXY ADHESIVE INCLUDING POLYMERIC TOUGHENER, CATIONIC PHOTOINITIATOR, AND THERMAL CATIONIC INITIATOR AND METHOD FOR USING SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2025-05-30 | — | — | WO | disclosed |
| WO-2025018368-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | 株式会社レゾナック | 2025-01-23 | — | — | WO | disclosed |
| WO-2025013728-A1 | ADHESIVE BODY AND METHOD FOR PRODUCING SAME | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| WO-2025013726-A1 | ADHESIVE COMPOSITION | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| CN-118742619-A | Adhesive composition, adhesive film for circuit connection, and method for producing connection structure | 株式会社力森诺科 | 2024-10-01 | — | — | CN | disclosed |
| CN-118525070-A | Adhesive composition, adhesive film for circuit connection, and method for producing connection structure | 株式会社力森诺科 | 2024-08-20 | — | — | CN | disclosed |
| WO-2024150766-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| US-7514202-B2 | Thermal acid generator, resist undercoat material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-04-07 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-20080199814-A1 | Device manufacturing process utilizing a double patterning process | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| WO-2008070060-A2 | DEVICE MANUFACTURING PROCESS UTILIZING A DOUBLE PATTERING PROCESS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-06-12 | — | — | WO | disclosed |
| US-20070264596-A1 | Thermal acid generator, resist undercoat material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-11-15 | — | — | US | disclosed |
| US-5066722-A | Quaternary ammonium sulfonates, hydroxy containing resins, polesters, polylactones, epoxy resins, acrylic resins | NIPPON PAINT CO., LTD. (JP) | 1991-11-19 | — | — | US | disclosed |