Fluoride Ion

Fluoride Ion

SCHEMBL127552

CC[N+](CC)(Cc1ccc(OC)cc1)c1ccc(C)cc1.[F-].[F-].[F-].[F-].[F-].[F-].[Sb+3]

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ACHE P22303 2/20 0.47
BCHE P06276 1/20 0.42
MAPT P10636 3/20 0.42
EGFR P00533 1/20 0.42
RELA Q04206 1/20 0.40
ALDH1A1 P00352 1/20 0.39
TDP1 Q9NUW8 1/20 0.38
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
ALOX5 P09917 1/20 0.38
IDO1 P14902 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
GFER P55789 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31325836 0.82 LTA4H (0.52) MAPTEGFRALDH1A1NPC1RAB9A
Fluoride Ion SCHEMBL124206 0.81 ACHE (0.50) ACHEBCHEMAPTEGFRRELA
SCHEMBL26197514 0.77 ACHE (0.54) ACHEBCHEMAPTEGFRRELA
SCHEMBL31325832 0.76 LMNA (0.39) ACHEBCHEALDH1A1TDP1L3MBTL1
Hydrochloric Acid SCHEMBL11423658 0.75 KDM4E (0.45) ACHEBCHEALDH1A1TDP1RAB9A
SCHEMBL7553593 0.73 ACHE (0.42) ACHEMAPTRELAALDH1A1TDP1
SCHEMBL30002343 0.72 L3MBTL1 (0.44) MAPTEGFRALDH1A1TDP1NPC1
SCHEMBL9712020 0.71 ACHE (0.44) ACHEMAPTRELAALDH1A1TDP1
SCHEMBL5675685 0.70 IDO1 (0.50) MAPTALDH1A1IDO1SMN1; SMN2
SCHEMBL3409810 0.69 ACHE (0.71) ACHEBCHEMAPTRELAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5556927-A FILMS, COATINGS, REACTION OF EPOXY RESIN OR LACTONE MODIFIED EPOXY RESIN WITH CYCLIC CARBONATE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-17 US claimed
WO-2024122416-A1 METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
WO-2023238836-A1 SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL 東亞合成株式会社 2023-12-14 WO disclosed
EP-4289618-A1 UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME Toagosei Co., Ltd. (JP) 2023-12-13 EP disclosed
US-20220186066-A1 PROTECTION MEMBER FOR SEMICONDUCTOR, PROTECTION COMPOSITION FOR INKJET COATING-TYPE SEMICONDUCTOR, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS USING SAME, AND SEMICONDUCTOR APPARATUS MITSUI CHEMICALS, INC. (JP) 2022-06-16 US disclosed
US-9136486-B2 Composition for organic semiconductor insulating films, and organic semiconductor insulating film TOAGOSEI CO., LTD. (JP) 2015-09-15 US disclosed
US-8987344-B2 Hardcoat composition MITSUI CHEMICALS, INC. (JP) 2015-03-24 US disclosed
US-20140326980-A1 COMPOSITION FOR ORGANIC SEMICONDUCTOR INSULATING FILMS, AND ORGANIC SEMICONDUCTOR INSULATING FILM TOAGOSEI CO., LTD. (JP) 2014-11-06 US disclosed
EP-2108027-B1 HARDCOAT COMPOSITION MITSUI CHEMICALS INC (JP) 2012-03-07 EP disclosed
WO-2008087741-A1 HARDCOAT COMPOSITION MITSUI CHEMICALS, INC. (JP) 2008-07-24 WO disclosed
US-20070037896-A1 polymerizable resin composition comprises an epoxy compound, a photo cation polymerization initiator, and a photo radical polymerization initiator; excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage; surface protective material for optical disks MITSUI CHEMICALS, INC. (JP) 2007-02-15 US disclosed
EP-1630189-A1 CATIONICALLY PHOTOPOLYMERIZABLE RESIN COMPOSITION AND OPTICAL DISK SURFACE PROTECTION MATERIAL Mitsui Chemicals, Inc. (JP) 2006-03-01 EP disclosed
US-6395340-B1 THERMOSETTING PAINT KANSAI PAINT CO., LTD. (JP) 2002-05-28 US disclosed
EP-1038935-A1 COATING COMPOSITION AND METHOD FOR COATING THEREWITH KANSAI PAINT CO., LTD. (JP) 2000-09-27 EP disclosed
EP-1026211-A1 COATING COMPOSITION AND METHOD FOR APPLYING THE SAME KANSAI PAINT CO., LTD. (JP) 2000-08-09 EP disclosed
EP-0687697-B1 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEM (JP) 2000-05-03 EP disclosed
US-5733982-A CURABLE COMPOSITIONS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-03-31 US disclosed
US-5556927-A FILMS, COATINGS, REACTION OF EPOXY RESIN OR LACTONE MODIFIED EPOXY RESIN WITH CYCLIC CARBONATE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-17 US disclosed
EP-0687697-A2 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1995-12-20 EP disclosed