Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADRA2A | P08913 | 1/20 | 0.33 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | BLM | P54132 | 1/20 | 0.32 |
| ▸ | CD81 | P60033 | 1/20 | 0.32 |
| ▸ | DGKA | P23743 | 1/20 | 0.32 |
| ▸ | PPARG | P37231 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.30 |
| ▸ | BACE1 | P56817 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1245603 | 1.00 | ADRA2A (0.33) | ADRA2AADRA1AMAPTBLMCD81 | |
| SCHEMBL17363355 | 0.89 | ADRA2A (0.42) | ADRA2AADRA1AMAPTBLMCD81 | |
| SCHEMBL11520488 | 0.86 | CD81 (0.33) | CD81PPARGALOX15 | |
| SCHEMBL4942900 | 0.86 | CD81 (0.33) | CD81PPARGALOX15 | |
| SCHEMBL4178740 | 0.84 | ADRA2A (0.34) | ADRA2AADRA1AMAPTBLMCD81 | |
| SCHEMBL4178735 | 0.84 | ADRA2A (0.34) | ADRA2AADRA1AMAPTBLMCD81 | |
| SCHEMBL6131136 | 0.84 | LMNA (0.39) | ADRA2AADRA1AMAPTBLMCD81 | |
| SCHEMBL28742803 | 0.80 | NAAA (0.42) | BLMCD81DGKAPPARGALOX15 | |
| SCHEMBL3404601 | 0.79 | DGKA (0.43) | DGKAALOX15TDP1 | |
| SCHEMBL36409 | 0.79 | MGAM (0.40) | CD81PPARGALOX15 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8273463-B2 | Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material | FUJIFILM CORPORATION (JP) | 2012-09-25 | — | — | US | disclosed |
| US-8187664-B2 | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same | FUJIFILM CORPORATION (JP) | 2012-05-29 | — | — | US | disclosed |
| US-7879535-B2 | A fine conductive metal pattern superior in heat resistance, adhesion property to a base surface and durability on a polyimide surface; simplification; grafting an acylic monomer on polyimide to interact with electroless plating catalyst; reduction of metal salt in defined pattern; printed circuit | FUJIFILM CORPORATION (JP) | 2011-02-01 | — | — | US | disclosed |
| US-20090269599-A1 | MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL | FUJIFILM CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090092766-A1 | GRAFT PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2009-04-09 | — | — | US | disclosed |
| US-20090022885-A1 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME | FUJIFILM CORPORATION (JP) | 2009-01-22 | — | — | US | disclosed |
| WO-2006123834-A2 | GRAFT PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2006-11-23 | — | — | WO | disclosed |
| US-20050214693-A1 | Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material | FUJI PHOTO FILM CO., LTD. | 2005-09-29 | — | — | US | disclosed |
| US-6919158-B2 | Conductive pattern material and method for forming conductive pattern | FUJI PHOTO FILM CO., LTD. (JP) | 2005-07-19 | — | — | US | disclosed |
| US-20030068581-A1 | Conductive pattern material and method for forming conductive pattern | FUJIFILM CORPORATION (JP) | 2003-04-10 | — | — | US | disclosed |
| EP-1282175-A2 | Conductive pattern material and method for forming conductive pattern | FUJI PHOTO FILM CO., LTD. (JP) | 2003-02-05 | — | — | EP | disclosed |