SCHEMBL4178740

SCHEMBL4178740

CC(=CCCOC(=O)CCBr)C(=O)O

nearest known ligand 0.36

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ADRA2A P08913 1/20 0.34
ADRA1A P35348 1/20 0.34
MAPT P10636 1/20 0.33
BLM P54132 1/20 0.33
CD81 P60033 1/20 0.33
CYP2C19 P33261 1/20 0.32
DGKA P23743 1/20 0.32
PPARG P37231 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
ALOX15 P16050 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
BACE1 P56817 1/20 0.31
MGLL Q99685 1/20 0.30
TRPV1 Q8NER1 1/20 0.30
TRPA1 O75762 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4178735 1.00 ADRA2A (0.34) ADRA2AADRA1AMAPTBLMCD81
SCHEMBL17363355 0.91 ADRA2A (0.42) ADRA2AADRA1AMAPTBLMCD81
SCHEMBL6131136 0.86 LMNA (0.39) ADRA2AADRA1AMAPTBLMCD81
SCHEMBL1245603 0.84 ADRA2A (0.33) ADRA2AADRA1AMAPTBLMCD81
SCHEMBL1245606 0.84 ADRA2A (0.33) ADRA2AADRA1AMAPTBLMCD81
SCHEMBL28742803 0.81 NAAA (0.42) BLMCD81CYP2C19DGKAPPARG
SCHEMBL3404601 0.80 DGKA (0.43) DGKAALOX15TDP1MGLL
SCHEMBL11520488 0.80 CD81 (0.33) CD81PPARGALOX15
SCHEMBL6549387 0.80 MGAM (0.40) CD81PPARGALOX15TRPA1
SCHEMBL36409 0.80 MGAM (0.40) CD81PPARGALOX15TRPA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-8187664-B2 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same FUJIFILM CORPORATION (JP) 2012-05-29 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090022885-A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed