Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RAB9A | P51151 | 4/20 | 0.52 |
| ▸ | NPC1 | O15118 | 7/20 | 0.46 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | MAPT | P10636 | 3/20 | 0.44 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.44 |
| ▸ | HTR2B | P41595 | 1/20 | 0.43 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 2/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.41 |
| ▸ | FGFR2 | P21802 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.40 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22207162 | 0.96 | RAB9A (0.47) | RAB9ANPC1HSP90AA1SMN1; SMN2ALDH1A1 | |
| SCHEMBL29354045 | 0.85 | NPC1 (0.47) | RAB9ANPC1SMN1; SMN2ALDH1A1MAPT | |
| SCHEMBL1245257 | 0.85 | NPC1 (0.47) | RAB9ANPC1SMN1; SMN2ALDH1A1MAPT | |
| SCHEMBL9566561 | 0.84 | RAB9A (0.52) | RAB9ANPC1HSP90AA1SMN1; SMN2ALDH1A1 | |
| SCHEMBL28608659 | 0.82 | RAB9A (0.43) | RAB9ANPC1HSP90AA1SMN1; SMN2ALDH1A1 | |
| SCHEMBL15025995 | 0.79 | MAPT (0.45) | RAB9ANPC1SMN1; SMN2ALDH1A1MAPT | |
| SCHEMBL16019276 | 0.79 | NPC1 (0.44) | RAB9ANPC1SMN1; SMN2ALDH1A1MAPT | |
| SCHEMBL5069137 | 0.77 | NPC1 (0.68) | RAB9ANPC1HSP90AA1SMN1; SMN2ALDH1A1 | |
| SCHEMBL9566466 | 0.77 | HTR2B (0.68) | RAB9ANPC1HSP90AA1SMN1; SMN2HTR2B | |
| SCHEMBL6842063 | 0.76 | NPC1 (0.41) | RAB9ANPC1SMN1; SMN2ALDH1A1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12606662-B2 | Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board | RESONAC CORPORATION (JP) | 2026-04-21 | — | — | US | disclosed |
| EP-3419051-B1 | CURABLE RESIN COMPOSITION AND FAN OUT TYPE WAFER LEVEL PACKAGE | TAIYO HOLDINGS CO LTD (JP) | 2026-04-08 | — | — | EP | disclosed |
| US-12498636-B2 | Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board | RESONAC CORPORATION (JP) | 2025-12-16 | — | — | US | disclosed |
| EP-3978544-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-10-08 | — | — | EP | disclosed |
| EP-4610290-A1 | CURABLE RESIN COMPOSITION, MULTILAYER STRUCTURE, CURED PRODUCT AND ELECTRONIC COMPONENT | TAIYO HOLDINGS CO., LTD. (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4610048-A1 | LAMINATED STRUCTURE, METHOD FOR PRODUCING SAME, CURED PRODUCT, AND ELECTRONIC COMPONENT | TAIYO HOLDINGS CO., LTD. (JP) | 2025-09-03 | — | — | EP | disclosed |
| US-20250271758-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250258430-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-08-14 | — | — | US | disclosed |
| WO-2025090486-A1 | MAGNET WIRE WITH LOW-PERMITTIVITY INSULATION | ESSEX SOLUTIONS USA LLC (US) | 2025-05-01 | — | — | WO | disclosed |
| US-20250079054-A1 | MAGNET WIRE WITH LOW-PERMITTIVITY INSULATION | BANK OF AMERICA, N.A., AS AGENT | 2025-03-06 | — | — | US | disclosed |
| WO-1998000759-A1 | PHOTOPOLYMERIZABLE THERMOSETTING RESIN COMPOSITION | CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) | 1998-01-08 | — | — | WO | disclosed |
| US-5702820-A | BLEND OF EPOXY RESIN AND UNSATURATED CARBOXYLIC ACID | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1997-12-30 | — | — | US | disclosed |
| EP-0663411-B1 | Photo-imaging resist ink and cured product thereof | NIPPON KAYAKU KK (JP) | 1997-05-28 | — | — | EP | disclosed |
| US-5538821-A | SOLDER RESIST, RESIST FOR ELECTROLESS DEPOSITION OF GOLD, EPOXY NOVALAK RESIN REACTED WITH HYDROXYL COMPOUND AND POLYBASIC UNSATURATED CARBOXYLIC ACID | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1996-07-23 | — | — | US | disclosed |
| EP-0663411-A1 | Photo-imaging resist ink and cured product thereof | Nippon Kayaku Kabushiki Kaisha (JP) | 1995-07-19 | — | — | EP | disclosed |
| EP-0624824-A1 | Resist ink composition and cured article prepared therefrom | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1994-11-17 | — | — | EP | disclosed |
| US-5100767-A | Epoxy resins | TAMURA KAKEN CO., LTD. (JP) | 1992-03-31 | — | — | US | disclosed |
| US-4320189-A | A THERMOPLASTIC BINDER | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1982-03-16 | — | — | US | disclosed |
| EP-0003799-B1 | FINELY DIVIDED EXPANDABLE STYRENE POLYMERS AND PROCESS FOR THEIR PREPARATION | HOECHST AKTIENGESELLSCHAFT (DE) | 1981-11-04 | — | — | EP | disclosed |
| US-4192922-A | Finely divided expandable styrene polymers | HOECHST AKTIENGESELLSCHAFT (DE) | 1980-03-11 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12606662-B2 | Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board | MMAB, ELOB, RARB | RAB9A 2311/4885NPC1 4646/4885HSP90AA1 2950/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.