SCHEMBL1262887

SCHEMBL1262887

CO[Si](CCl)(c1ccccc1)c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CA4 P22748 1/20 0.33
ESR1 P03372 1/20 0.31
ESR2 Q92731 1/20 0.31
LTA4H P09960 1/20 0.30
POLB P06746 1/20 0.30
TTR P02766 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL647836 0.81 CA4 (0.36) CA4ESR1ESR2LTA4HPOLB
SCHEMBL647415 0.81 CA4 (0.36) CA4ESR1ESR2LTA4HPOLB
SCHEMBL705542 0.79 CA4 (0.35) CA4ESR1ESR2LTA4HPOLB
SCHEMBL4079890 0.78 LTA4H (0.32) LTA4H
SCHEMBL703898 0.77 CA4 (0.33) CA4ESR1ESR2LTA4HPOLB
SCHEMBL4079195 0.77 CA4 (0.33) CA4ESR1ESR2LTA4HPOLB
SCHEMBL27996306 0.77 CA4 (0.35) CA4ESR1ESR2LTA4HPOLB
SCHEMBL4076791 0.77 TRPA1 (0.33) CA4ESR1ESR2LTA4HPOLB
SCHEMBL15912070 0.77 ESR1 (0.35) CA4ESR1ESR2LTA4HPOLB
SCHEMBL646824 0.77 CA4 (0.33) CA4ESR1ESR2LTA4HPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1746122-B1 METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE AND SEMICONDUCTOR DEVICE JSR CORP (JP) 2013-06-12 EP disclosed
EP-1705207-B1 METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM JSR CORP (JP) 2012-10-24 EP disclosed
US-8268403-B2 Curing a coating of a siloxane compound and a carbosilane compound using ultraviolet radiation; a low relative dielectric constant, excellent chemical resistance, plasma resistance, mechanical strength JSR CORPORATION (JP) 2012-09-18 US disclosed
EP-1981074-B1 ORGANIC SILICA FILM AND METHOD FOR FORMING SAME, COMPOSITION FOR FORMING INSULATING FILM OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME, WIRING STRUCTURE AND SEMICONDUCTOR DEVICE JSR CORP (JP) 2011-06-22 EP disclosed
US-7893538-B2 Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device JSR CORPORATION (JP) 2011-02-22 US disclosed
US-20100007025-A1 ORGANIC SILICA FILM AND METHOD FOR FORMING SAME, COMPOSITION FOR FORMING INSULATING FILM OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME, WIRING STRUCTURE AND SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2010-01-14 US disclosed
US-7528207-B2 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film JSR CORPORATION (JP) 2009-05-05 US disclosed
US-20080268264-A1 Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation JSR CORPORATION (JP) 2008-10-30 US disclosed
EP-1981074-A1 ORGANIC SILICA FILM AND METHOD FOR FORMING SAME, COMPOSITION FOR FORMING INSULATING FILM OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME, WIRING STRUCTURE AND SEMICONDUCTOR DEVICE JSR Corporation (JP) 2008-10-15 EP disclosed
US-20080038527-A1 Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation JSR CORPORATION (JP) 2008-02-14 US disclosed
US-20070021580-A1 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film JSR CORPORATION (JP) 2007-01-25 US disclosed
EP-1746122-A1 METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION JSR Corporation (JP) 2007-01-24 EP disclosed
EP-1746123-A1 METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION JSR Corporation (JP) 2007-01-24 EP disclosed
US-20070015892-A1 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film JSR CORPORATION (JP) 2007-01-18 US disclosed
EP-1705206-A1 METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM JSR Corporation (JP) 2006-09-27 EP disclosed
EP-1705207-A1 METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM JSR Corporation (JP) 2006-09-27 EP disclosed