SCHEMBL127004

SCHEMBL127004

O=C(O)c1ccc(C(c2ccc(C(=O)O)c(C(=O)O)c2)c2ccccc2[SiH3])cc1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 7/20 0.49
▸ TDP1 Q9NUW8 6/20 0.49
▸ KMT2A Q03164 4/20 0.49
▸ GAA P10253 1/20 0.49
▸ HSD17B10 Q99714 6/20 0.47
▸ MEN1 O00255 3/20 0.47
▸ CYP2C9 P11712 3/20 0.47
▸ CYP2C19 P33261 2/20 0.47
▸ CYP2D6 P10635 1/20 0.47
▸ GRM8 O00222 1/20 0.47
▸ GRM6 O15303 1/20 0.47
▸ SLC6A2 P23975 1/20 0.47
▸ SLC6A4 P31645 1/20 0.47
▸ DRD3 P35462 1/20 0.47
▸ GRM4 Q14833 1/20 0.47
▸ CDC25A P30304 1/20 0.41
▸ CDC25B P30305 1/20 0.41
▸ ALOX15 P16050 1/20 0.41
▸ KDM4E B2RXH2 5/20 0.37
▸ POLB P06746 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28488996 0.79 HSD17B10 (0.56) ALDH1A1TDP1KMT2AGAAHSD17B10
SCHEMBL11770761 0.76 HSD17B10 (0.53) ALDH1A1TDP1KMT2AGAAHSD17B10
SCHEMBL4531262 0.69 HSD17B10 (0.53) ALDH1A1TDP1KMT2AHSD17B10MEN1
SCHEMBL1955154 0.69 HSD17B10 (0.62) ALDH1A1TDP1KMT2AHSD17B10MEN1
SCHEMBL8945914 0.67 ALDH1A1 (0.79) ALDH1A1TDP1KMT2AGAACYP2D6
SCHEMBL1356399 0.67 HSD17B10 (0.60) ALDH1A1TDP1KMT2AHSD17B10MEN1
SCHEMBL11770754 0.67 HSD17B10 (0.60) ALDH1A1TDP1KMT2AHSD17B10MEN1
SCHEMBL29401129 0.67 HSD17B10 (0.60) ALDH1A1TDP1KMT2AHSD17B10MEN1
SCHEMBL20240086 0.67 HSD17B10 (0.66) ALDH1A1TDP1KMT2AGAAHSD17B10
SCHEMBL22733 0.67 HSD17B10 (0.60) ALDH1A1TDP1KMT2AHSD17B10MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240381529-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG RESONAC CORPORATION (JP) 2024-11-14 — — US disclosed
WO-2023042305-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG 株式会社レゾナック 2023-03-23 — — WO disclosed
WO-2020137879-A1 POWDER LIQUID DISPERSION, LAYERED PRODUCT, AND PRINTED BASE BOARD AGC株式会社 2020-07-02 — — WO disclosed
US-10580640-B2 Kit and laminate FUJIFILM CORPORATION (JP) 2020-03-03 — — US disclosed
US-10428253-B2 Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device HITACHI CHEMICAL COMPANY, LTD (JP) 2019-10-01 — — US disclosed
US-10328683-B2 Adhesive agent, adhesive material using the same, and method of use thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-06-25 — — US disclosed
US-10322572-B2 Adhesive agent, adhesive material using the same, and method of use thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-06-18 — — US disclosed
US-10287458-B2 Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film FUJIFILM CORPORATION (JP) 2019-05-14 — — US disclosed
EP-2662378-B1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORP (JP) 2018-10-10 — — EP disclosed
US-20180016471-A1 LAMINATE, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM FUJIFILM CORPORATION (JP) 2018-01-18 — — US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 — — EP disclosed
US-6001277-A Liquid-crystal alignment film HITACHI CHEMICAL COMPANY, LTD. (JP) 1999-12-14 — — US disclosed
EP-0837498-A1 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE HITACHI CHEMICAL CO., LTD. (JP) 1998-04-22 — — EP disclosed
US-5667899-A SELF-SUPPORTING BONDING FILM OF POLYIMIDES HITACHI CHEMICAL CO. LTD. (JP) 1997-09-16 — — US disclosed
US-5605763-A POLYIMIDE; SEMICONDUCTORS HITACHI CHEMICAL COMPANY LTD. (JP) 1997-02-25 — — US disclosed
US-5571579-A FORMING A POLYIMIDE FILM AND RUBBING THE SURFACE OF THE FILM HITACHI CHEMICAL COMPANY, LTD (JP) 1996-11-05 — — US disclosed
EP-0450926-B1 Fluorine-containing polyimides and precursors thereof HITACHI CHEMICAL CO LTD (JP) 1996-07-31 — — EP disclosed
US-5401878-A Fluorinated unsaturated alkyl ether aryldiamines for polyimide polymers with heat resistance and waterproofing HITACHI CHEMICAL COMPANY, LTD. (JP) 1995-03-28 — — US disclosed
US-5270438-A Fluorine-containing polyimides and precursors thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 1993-12-14 — — US disclosed
EP-0450926-A2 Fluorine-containing polyimides and precursors thereof Hitachi Chemical Co., Ltd. (JP) 1991-10-09 — — EP disclosed
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