SCHEMBL29401129

SCHEMBL29401129

CC(c1ccc(C(=O)O)c(C(=O)O)c1)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HSD17B10 Q99714 6/20 0.60
▸ TDP1 Q9NUW8 5/20 0.60
▸ MEN1 O00255 3/20 0.60
▸ CYP2C9 P11712 3/20 0.60
▸ KMT2A Q03164 3/20 0.60
▸ CYP2C19 P33261 2/20 0.60
▸ CYP2D6 P10635 1/20 0.60
▸ GRM8 O00222 1/20 0.60
▸ GRM6 O15303 1/20 0.60
▸ SLC6A2 P23975 1/20 0.60
▸ SLC6A4 P31645 1/20 0.60
▸ DRD3 P35462 1/20 0.60
▸ GRM4 Q14833 1/20 0.60
▸ ALDH1A1 P00352 7/20 0.55
▸ SORT1 Q99523 1/20 0.43
▸ KDM4E B2RXH2 4/20 0.43
▸ HPGD P15428 4/20 0.43
▸ GRM1 Q13255 3/20 0.43
▸ GRM2 Q14416 2/20 0.43
▸ RXRA P19793 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22733 1.00 HSD17B10 (0.60) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL4531262 0.92 HSD17B10 (0.53) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL10483725 0.91 RXRA (0.55) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL1356399 0.87 HSD17B10 (0.60) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL9853831 0.85 HSD17B10 (0.58) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL20240085 0.83 MEN1 (0.61) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL18586485 0.83 HSD17B10 (0.67) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL2833452 0.83 KDM4E (0.62) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL9860148 0.82 KDM4E (0.57) HSD17B10TDP1MEN1CYP2C9KMT2A
SCHEMBL23005779 0.82 ALDH1A1 (0.51) HSD17B10TDP1MEN1CYP2C9KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 203 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114929474-B Flexible metal-clad laminate with microstrip line structure 株式会社钟化 2025-01-07 — — CN claimed
CN-115122735-B Polyimide, resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-clad laminate, and circuit board NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) 2026-05-26 — — CN disclosed
CN-117048152-B Method for manufacturing metal-clad laminate NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) 2026-05-26 — — CN disclosed
WO-2026105817-A1 ADHESIVE FILM AND WOUND BODY 積水化学工業株式会社 2026-05-21 — — WO disclosed
CN-115891346-B Metal-clad laminate, circuit board, electronic component, and electronic device 日铁化学材料株式会社 2026-05-15 — — CN disclosed
WO-2026097702-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR PREPARING PATTERN, CURED PRODUCT, AND ELECTRONIC COMPONENT 江苏艾森半导体材料股份有限公司 2026-05-15 — — WO disclosed
WO-2026097701-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITION, PATTERN MANUFACTURING METHOD, CURED PRODUCT, AND ELECTRONIC COMPONENT 江苏艾森半导体材料股份有限公司 2026-05-15 — — WO disclosed
EP-4697102-A1 POLYIMIDE TUBE I.S.T Corporation (JP) 2026-02-18 — — EP disclosed
EP-4674897-A1 FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN I.S.T Corporation (JP) 2026-01-07 — — EP disclosed
US-20250361370-A1 FIBER-REINFORCED RESIN MOLDED BODY IST CORP (JP) 2025-11-27 — — US disclosed
WO-2022050041-A1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD 富士フイルム株式会社 2022-03-10 — — WO disclosed
CN-114144390-A Graphite sheet and electronic device comprising same 聚酰亚胺先端材料有限公司 2022-03-04 — — CN disclosed
WO-2022045124-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 — — WO disclosed
WO-2022045123-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION 富士フイルム株式会社 2022-03-03 — — WO disclosed
WO-2022045120-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR MANUFACTURING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 — — WO disclosed
WO-2022045059-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 — — WO disclosed
WO-2022045060-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-03 — — WO disclosed
CN-109239816-B Laminated film, and display device including the same 三星电子株式会社 2022-02-25 — — CN disclosed
WO-2022039028-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING CURED PRODUCT 東レ株式会社 2022-02-24 — — WO disclosed
WO-2022032306-A1 PROCESS FOR POLYIMIDE SYNTHESIS AND POLYIMIDES MADE THEREFROM ZYMERGEN INC. (US) 2022-02-10 — — WO disclosed
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