SCHEMBL1270184

SCHEMBL1270184

OCC(O)COSSOCC(O)CO

nearest known ligand 0.44

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
LMNA P02545 4/20 0.44
ALDH1A1 P00352 1/20 0.44
USP2 O75604 1/20 0.37
THRB P10828 1/20 0.36
CYP1A2 P05177 3/20 0.33
KDM4E B2RXH2 3/20 0.33
AGTR1 P30556 1/20 0.33
MEN1 O00255 2/20 0.32
KMT2A Q03164 2/20 0.32
DUSP3 P51452 1/20 0.32
TSHR P16473 1/20 0.31
MAPK1 P28482 1/20 0.31
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2050014 0.85
SCHEMBL75408 0.82 LMNA (0.44) LMNAALDH1A1USP2THRBCYP1A2
SCHEMBL11661082 0.80
SCHEMBL2050717 0.78
SCHEMBL8581848 0.78
SCHEMBL27697564 0.78
SCHEMBL3493341 0.74 LMNA (0.38) LMNA
SCHEMBL27816434 0.74
SCHEMBL5013799 0.72
SCHEMBL1638881 0.71 LMNA (0.53) LMNAALDH1A1USP2THRBCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12588450-B2 Post-CMP cleaning liquid comprising a substituted benzene anticorrosive agent, chelant, and amine compound FUJIFILM CORPORATION (JP) 2026-03-24 US disclosed
US-20250377594-A1 RESIST COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-12-11 US disclosed
US-12480072-B2 Cleaning fluid and cleaning method FUJIFILM CORPORATION (JP) 2025-11-25 US disclosed
US-20250321482-A1 RESIST COMPOSITION, DRY FILM RESIST, METHOD FOR PRODUCING DRY FILM RESIST, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED OBJECT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-10-16 US disclosed
US-20250278022-A1 COMPOUND, POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-09-04 US disclosed
US-20250231484-A1 RESIST COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-07-17 US disclosed
US-12264275-B2 Treatment liquid FUJIFILM CORPORATION (JP) 2025-04-01 US disclosed
US-12247300-B2 Cleaning solution and cleaning method FUJIFILM CORPORATION (JP) 2025-03-11 US disclosed
US-20250019623-A1 CLEANING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE FUJIFILM CORPORATION (JP) 2025-01-16 US disclosed
US-20250019836-A1 TREATMENT LIQUID, TREATMENT METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2025-01-16 US disclosed
US-20070243494-A1 Photoresist stripping solution and a method of stripping photoresists using the same YOKOI SHIGERU 2007-10-18 US disclosed
EP-1818722-A1 CHEMICAL AMPLIFICATION PHOTORESIST COMPOSITION, PHOTORESIST LAYER LAMINATE, METHOD FOR PRODUCING PHOTORESIST COMPOSITION, METHOD FOR PRODUCING PHOTORESIST PATTERN AND METHOD FOR PRODUCING CONNECTING TERMINAL TOKYO OHKA KOGYO CO., LTD. (JP) 2007-08-15 EP disclosed
US-20070134185-A1 Use of dithiols in a hair-perming composition L'OREAL S.A. (FR) 2007-06-14 US disclosed
US-20070003859-A1 Photoresist stripping solution and a method of stripping photoresists using the same YOKOI SHIGERU 2007-01-04 US disclosed
EP-1680077-A2 USE OF DITHIOLS IN A HAIR-PERMING COMPOSITION L'OREAL (FR) 2006-07-19 EP disclosed
US-20060035176-A1 Photoresist stripping solution and a method of stripping photoresists using the same YOKOI SHIGERU 2006-02-16 US disclosed
US-20050002886-A1 Dithiols comprising at least one amide functional group and their use in transforming the shape of the hair L'OREAL S.A. (FR) 2005-01-06 US disclosed
WO-2004098488-A2 USE OF DITHIOLS IN A HAIR-PERMING COMPOSITION L'OREAL (FR) 2004-11-18 WO disclosed
EP-1475076-A1 Amidic dithiols and their use in changing the hair form L'OREAL (FR) 2004-11-10 EP disclosed
US-20030099908-A1 Photoresist stripping solution and a method of stripping photoresists using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2003-05-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070134185-A1 Use of dithiols in a hair-perming composition DSG1, DSC1, DUS2 LMNA 2739/4885ALDH1A1 1467/4885USP2 3486/4885
US-20250278022-A1 COMPOUND, POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN ABCC1, SLC11A2, RER1 LMNA 2700/4885ALDH1A1 2612/4885USP2 3977/4885
US-20050002886-A1 Dithiols comprising at least one amide functional group and their use in transforming the shape of the hair TST, KRT18, DLAT LMNA 4162/4885ALDH1A1 134/4885USP2 2671/4885
US-12588450-B2 Post-CMP cleaning liquid comprising a substituted benzene anticorrosive agent, chelant, and amine compound SSRP1, H1-5, AOC1 LMNA 1164/4885ALDH1A1 55/4885USP2 1323/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.