SCHEMBL13028396

SCHEMBL13028396

O=C(c1ccc(Oc2ccc(C(=O)n3ccnc3)cc2)cc1)n1ccnc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FAAH O00519 2/20 0.46
MGLL Q99685 2/20 0.46
SLC6A7 Q99884 1/20 0.43
TBXAS1 P24557 6/20 0.42
KMT2A Q03164 2/20 0.41
MEN1 O00255 1/20 0.41
LMNA P02545 1/20 0.41
MAPT P10636 2/20 0.41
ALDH1A1 P00352 1/20 0.41
PARP15 Q460N3 1/20 0.41
PARP14 Q460N5 1/20 0.41
PARP10 Q53GL7 1/20 0.41
PARP16 Q8N5Y8 1/20 0.41
PARP11 Q9NR21 1/20 0.41
PARP4 Q9UKK3 1/20 0.41
HPGD P15428 1/20 0.41
RAB9A P51151 1/20 0.41
CYP19A1 P11511 3/20 0.40
HTT P42858 1/20 0.40
CYP3A4 P08684 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9807751 0.89 CYP19A1 (0.46) FAAHMGLLTBXAS1MAPTCYP19A1
SCHEMBL11110140 0.87 CYP19A1 (0.55) SLC6A7TBXAS1KMT2ALMNAMAPT
SCHEMBL13028408 0.84 ADH5 (0.51) SLC6A7MAPTALDH1A1CYP19A1HTT
SCHEMBL31388182 0.83 CYP19A1 (0.52) KMT2AMEN1LMNARAB9ACYP19A1
SCHEMBL18280916 0.82 ADH5 (0.54) TBXAS1KMT2AMEN1LMNACYP19A1
SCHEMBL31388138 0.81 TPMT (0.41) MAPTCYP19A1HTTCYP3A4BAZ2B
SCHEMBL9879507 0.81 LSS (0.47) SLC6A7KMT2AMAPTCYP19A1
SCHEMBL30580646 0.81 LTA4H (0.47) SLC6A7KMT2ACYP19A1CYP3A4
SCHEMBL11106769 0.81 MAOB (0.46) SLC6A7KMT2ALMNAALDH1A1CYP19A1
SCHEMBL4808545 0.81 CYP19A1 (0.48) LMNAMAPTALDH1A1HPGDCYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4276055-A1 HOLLOW STRUCTURE, ELECTRONIC COMPONENT USING SAME, AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2023-11-15 EP disclosed
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same TORAY INDUSTRIES, INC. (JP) 2023-10-31 US disclosed
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same TORAY INDUSTRIES, INC. (JP) 2023-10-31 US disclosed
WO-2023195319-A1 POSITIVE PHOTOSENSITIVE PIGMENT COMPOSITION, CURED FILM CONTAINING CURED PRODUCT THEREOF, AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2023-10-12 WO disclosed
US-11347146-B2 Resin composition TORAY INDUSTRIES, INC. (JP) 2022-05-31 US disclosed
US-11279802-B2 Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device TORAY INDUSTRIES, INC. (JP) 2022-03-22 US disclosed
US-11174350-B2 Resin and photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2021-11-16 US disclosed
US-20210047470-A1 ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, INTERLAYER INSULATING FILM OR SEMICONDUCTOR PROTECTIVE FILM, PRODUCTION METHOD FOR RELIEF PATTERN OF CURED FILM, AND ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2021-02-18 US disclosed
US-20190256655-A1 DI-AMINE COMPOUND, AND HEAT-RESISTANT RESIN AND RESIN COMPOSITION USING THE SAME TORAY INDUSTRIES, INC. (JP) 2019-08-22 US disclosed
US-20190250511-A1 RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2019-08-15 US disclosed
US-20190081258-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2019-03-14 US disclosed
US-9188860-B2 Method for producing polyamide and resin composition TORAY INDUSTRIES, INC. (JP) 2015-11-17 US disclosed
US-9188860-B2 Method for producing polyamide and resin composition TORAY INDUSTRIES, INC. (JP) 2015-11-17 US disclosed
US-20100285404-A1 METHOD FOR PRODUCING POLYAMIDE AND RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-11-11 US disclosed
US-20100285404-A1 METHOD FOR PRODUCING POLYAMIDE AND RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-11-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same CAD, ARID2, SMC3 FAAH 2135/4885MGLL 3215/4885SLC6A7 3473/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.