SCHEMBL13086114

SCHEMBL13086114

C[Si](C)(C)O[Si](C)(C)c1ccc(O)c(N)c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.44
HSD17B10 Q99714 5/20 0.44
ALOX15 P16050 5/20 0.44
GAA P10253 8/20 0.43
MAPT P10636 4/20 0.43
MEN1 O00255 3/20 0.43
KMT2A Q03164 3/20 0.43
RECQL P46063 2/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
KDM4E B2RXH2 2/20 0.43
THRB P10828 2/20 0.43
BLM P54132 1/20 0.43
MCL1 Q07820 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ALOX12 P18054 3/20 0.40
HTT P42858 2/20 0.40
PKM P14618 2/20 0.40
HIF1A Q16665 1/20 0.40
HPGD P15428 3/20 0.39
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6853210 0.85 ALDH1A1 (0.44) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL6852410 0.78 ALDH1A1 (0.52) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL13086248 0.78 ALDH1A1 (0.52) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL12339907 0.72 ESR1 (0.57) ALDH1A1HSD17B10ALOX15MAPTKDM4E
SCHEMBL6853462 0.70 GAA (0.42) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL3922330 0.68 CYP3A4 (0.48) ALDH1A1HSD17B10ALOX15MAPTMEN1
SCHEMBL13086261 0.65 ACHE (0.40) ALDH1A1MEN1KMT2ASMN1; SMN2TDP1
SCHEMBL9009151 0.64 AR (0.68) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL27932649 0.64 ALDH1A1 (0.41) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL10338155 0.64 ALDH1A1 (0.46) ALDH1A1HSD17B10TDP1LMNACA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8420291-B2 Positive photosensitive resin composition, method for forming pattern, electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-04-16 US disclosed
US-20100258336-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-10-14 US disclosed