SCHEMBL13086248

SCHEMBL13086248

C[Si](C)(C)c1ccc(O)c(N)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.52
HSD17B10 Q99714 6/20 0.52
ALOX15 P16050 6/20 0.52
GAA P10253 8/20 0.47
MAPT P10636 4/20 0.47
ALOX12 P18054 3/20 0.47
MEN1 O00255 3/20 0.47
KMT2A Q03164 3/20 0.47
RECQL P46063 2/20 0.47
HTT P42858 2/20 0.47
PKM P14618 2/20 0.47
HIF1A Q16665 1/20 0.47
HPGD P15428 3/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
MAPK1 P28482 1/20 0.46
KDM4E B2RXH2 2/20 0.45
THRB P10828 2/20 0.45
BLM P54132 1/20 0.45
MCL1 Q07820 1/20 0.45
TDP1 Q9NUW8 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6852410 0.86 ALDH1A1 (0.52) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL18604566 0.78 TRPA1 (0.46) ALDH1A1HSD17B10ALOX15ALOX12MEN1
SCHEMBL13086114 0.78 ALDH1A1 (0.44) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL6853210 0.78 ALDH1A1 (0.44) ALDH1A1HSD17B10ALOX15GAAMAPT
SCHEMBL13318430 0.74 ESR1 (0.36) TDP1ESR1ARESR2ACHE
SCHEMBL4857124 0.74 ESR1 (0.61) ALDH1A1HSD17B10ALOX15MAPTALOX12
SCHEMBL8932066 0.73 HSD17B10 (0.38) ALDH1A1HSD17B10MAPTPKMSMN1; SMN2
SCHEMBL16550138 0.73 POLB (0.34) ALDH1A1MAPTMEN1KMT2ARECQL
SCHEMBL1920935 0.73 ACHE (0.39) HSD17B10KDM4ELMNAESR1AR
SCHEMBL9009151 0.71 AR (0.68) ALDH1A1HSD17B10ALOX15GAAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8420291-B2 Positive photosensitive resin composition, method for forming pattern, electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-04-16 US disclosed
US-8420291-B2 Positive photosensitive resin composition, method for forming pattern, electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-04-16 US disclosed
US-20100258336-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-10-14 US disclosed