SCHEMBL13086261

SCHEMBL13086261

Cc1ccc([Si](C)(C)O[Si](C)(C)C)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 5/20 0.40
TDP1 Q9NUW8 1/20 0.40
AGXT P21549 2/20 0.34
KMT2A Q03164 2/20 0.33
MEN1 O00255 1/20 0.33
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA7 P43166 1/20 0.32
CA9 Q16790 1/20 0.32
ALDH1A1 P00352 1/20 0.32
NPC1 O15118 2/20 0.31
RAB9A P51151 2/20 0.31
NOTUM Q6P988 1/20 0.30
POLB P06746 1/20 0.30
HPGD P15428 1/20 0.30
NFKB1 P19838 1/20 0.30
NFKB2 Q00653 1/20 0.30
RELA Q04206 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9743132 0.90 ACHE (0.44) ACHETDP1AGXTKMT2AMEN1
SCHEMBL9563138 0.84 ALDH1A1 (0.57) TDP1KMT2AMEN1ALDH1A1NPC1
SCHEMBL12977053 0.80 LMNA (0.34) ACHETDP1NPC1RAB9APOLB
SCHEMBL17921304 0.80 ACHE (0.40) ACHETDP1AGXTKMT2AMEN1
SCHEMBL8099751 0.78
SCHEMBL18125 0.77 ESR1 (0.39) ACHELMNATSHR
SCHEMBL3482430 0.77 ACHE (0.42) ACHETDP1AGXTKMT2AMEN1
SCHEMBL8736156 0.76 SMN1; SMN2 (0.36) TDP1KMT2AMEN1CA1CA2
SCHEMBL8736157 0.76 SMN1; SMN2 (0.36) TDP1KMT2AMEN1CA1CA2
SCHEMBL21667296 0.75 TP53 (0.37) TDP1CA2ALDH1A1NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8420291-B2 Positive photosensitive resin composition, method for forming pattern, electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-04-16 US disclosed
US-20100258336-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-10-14 US disclosed