SCHEMBL131373

SCHEMBL131373

CC(Cc1ccc(OCC2CO2)cc1)c1ccc(OCC2CO2)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.53
TP53 P04637 3/20 0.53
TSHR P16473 3/20 0.53
MAPT P10636 2/20 0.53
HPGD P15428 2/20 0.53
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
HIF1A Q16665 2/20 0.53
CYP1A2 P05177 1/20 0.53
PPARG P37231 1/20 0.53
TDP1 Q9NUW8 1/20 0.51
PKM P14618 2/20 0.49
LMNA P02545 1/20 0.49
GAA P10253 1/20 0.49
CYP3A4 P08684 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
ACACB O00763 1/20 0.41
GLA P06280 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10691467 0.93 ESR1 (0.58) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL4437068 0.93 TDP1 (0.59) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL4437074 0.93 TDP1 (0.59) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL28865920 0.91 ALDH1A1 (0.58) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL6757523 0.91 KMT2A (0.45) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL30933067 0.86 ALDH1A1 (0.40) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL4365824 0.86 ALDH1A1 (0.57) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL8561753 0.86 THRB (0.43) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL51699 0.84 ALDH1A1 (0.55) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL7789081 0.84 TDP1 (0.59) ALDH1A1TP53TSHRMAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5008309-A Epoxy resin, curing agent and fillers ASMO CO., LTD. (JP) 1991-04-16 US claimed
CN-106009526-A Novel sealing thermocuring environment-friendly epoxy resin material 黄宇 2016-10-12 CN disclosed
US-8987364-B2 Transparent film PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2015-03-24 US disclosed
US-20120219774-A1 TRANSPARENT FILM PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2012-08-30 US disclosed
US-20120058320-A1 TRANSPARENT FILM PANASONIC ELECTRIC WORKS CO. LTD (JP) 2012-03-08 US disclosed
US-5043184-A Applying epoxy resin, curing agent, photopolymerizable compound, and photoinitiator; irradiating with actinic light, heating SOMAR CORPORATION (JP) 1991-08-27 US disclosed
US-5008309-A Epoxy resin, curing agent and fillers ASMO CO., LTD. (JP) 1991-04-16 US disclosed
EP-0419737-A2 Molding method SOMAR CORPORATION (JP) 1991-04-03 EP disclosed
EP-0381899-A2 Thermosetting composition SOMAR CORPORATION (JP) 1990-08-16 EP disclosed
EP-0377332-A2 Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface SOMAR CORPORATION (JP) 1990-07-11 EP disclosed