SCHEMBL13346526

SCHEMBL13346526

NC(=O)CC1C(CC(N)=O)C2CC1C1C3C=CC(C3)C21

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 1/20 0.39
▸ SMN1; SMN2 Q16637 1/20 0.33
▸ L3MBTL1 Q9Y468 1/20 0.33
▸ MEN1 O00255 1/20 0.30
▸ KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14117817 0.92 RAB9A (0.34) RAB9A
SCHEMBL13346528 0.90 RAB9A (0.33) RAB9A
SCHEMBL13346518 0.88 RAB9A (0.34) RAB9A
SCHEMBL13346679 0.82 HSD11B1 (0.41) SMN1; SMN2L3MBTL1
SCHEMBL13346510 0.81 RAB9A (0.44) RAB9ASMN1; SMN2L3MBTL1MEN1KMT2A
SCHEMBL13346372 0.81 SMN1; SMN2 (0.33) SMN1; SMN2L3MBTL1
SCHEMBL13370622 0.77 PKM (0.35) SMN1; SMN2MEN1KMT2A
SCHEMBL13370540 0.75 — —
SCHEMBL13346672 0.75 SMN1; SMN2 (0.36) SMN1; SMN2L3MBTL1MEN1KMT2A
SCHEMBL13346523 0.75 RAB9A (0.35) RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7714087-B2 Polar group-containing olefin copolymer, process for preparing the same, thermoplastic resin composition containing the copolymer, and uses thereof MITSUI CHEMICALS, INC. (JP) 2010-05-11 — — US disclosed
US-20090137757-A1 Polar group-containing olefin copolymer, process for preparing the same, thermoplastic resin composition containing the copolymer, and uses thereof IMUTA JUNICHI 2009-05-28 — — US disclosed
US-7393907-B2 Polar group-containing olefin copolymer, process for preparing the same, thermoplastic resin composition containing the copolymer, and uses thereof MITSUI CHEMICALS, INC. (JP) 2008-07-01 — — US disclosed
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