SCHEMBL13432155

SCHEMBL13432155

O=C1CCCN1C(=O)c1cccc(C(=O)N2CCNC2=O)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.48
MEN1 O00255 3/20 0.48
MAPT P10636 2/20 0.48
CYP1A2 P05177 2/20 0.48
CYP2D6 P10635 2/20 0.48
CYP2C9 P11712 2/20 0.48
CYP2C19 P33261 2/20 0.48
KDM4E B2RXH2 1/20 0.48
THRB P10828 1/20 0.48
RECQL P46063 1/20 0.48
BLM P54132 1/20 0.48
SMN1; SMN2 Q16637 2/20 0.43
MITF O75030 1/20 0.43
ALDH1A1 P00352 2/20 0.43
CYP3A4 P08684 1/20 0.43
HPGD P15428 1/20 0.43
TSHR P16473 1/20 0.41
KRAS P01116 1/20 0.39
CRBN Q96SW2 1/20 0.39
GAA P10253 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1823033 0.88 KMT2A (0.58) KMT2AMEN1MAPTCYP1A2CYP2D6
SCHEMBL3390530 0.88 MAPT (0.55) KMT2AMEN1MAPTKDM4ESMN1; SMN2
SCHEMBL11194139 0.85 MAPT (0.45) KMT2AMEN1MAPTKDM4ESMN1; SMN2
SCHEMBL11453383 0.84 L3MBTL3 (0.44) KMT2AMEN1MAPTKDM4EALDH1A1
SCHEMBL9335604 0.84 SMN1; SMN2 (0.57) KMT2AMEN1MAPTCYP1A2CYP2D6
SCHEMBL5182442 0.82 MITF (0.60) KMT2AMEN1MAPTCYP1A2CYP2D6
SCHEMBL1824654 0.82 MITF (0.60) KMT2AMEN1MAPTCYP1A2CYP2D6
SCHEMBL11385930 0.78 PKM (0.51) KMT2AMAPTCYP2C9CYP2C19ALDH1A1
SCHEMBL10832472 0.78 SMN1; SMN2 (0.55) MAPTSMN1; SMN2ALDH1A1HPGDGAA
SCHEMBL11818563 0.78 HPGD (0.55) KMT2AMEN1MAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7683153-B2 Epoxy resin with dibasic acid (methyl ester)/ethyleneurea modifier ARDES ENTERPRISES, INC. (US) 2010-03-23 US disclosed
US-20080227950-A1 Latent Epoxy Hardeners Based on Amines Blocked by Acyl-Ethyleneurea, Epoxy Composition Containing the Same and Method of Preparation Thereof ARDES ENTERPRISES, INC. 2008-09-18 US disclosed