Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 7/20 | 0.62 |
| ▸ | HDAC2 | Q92769 | 3/20 | 0.51 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.51 |
| ▸ | HDAC4 | P56524 | 2/20 | 0.51 |
| ▸ | HDAC7 | Q8WUI4 | 2/20 | 0.51 |
| ▸ | HDAC10 | Q969S8 | 2/20 | 0.51 |
| ▸ | HDAC11 | Q96DB2 | 2/20 | 0.51 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.51 |
| ▸ | HDAC6 | Q9UBN7 | 2/20 | 0.51 |
| ▸ | HDAC9 | Q9UKV0 | 2/20 | 0.51 |
| ▸ | HDAC5 | Q9UQL6 | 2/20 | 0.51 |
| ▸ | BRAF | P15056 | 1/20 | 0.51 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | LMNA | P02545 | 1/20 | 0.49 |
| ▸ | POLB | P06746 | 1/20 | 0.49 |
| ▸ | PKM | P14618 | 1/20 | 0.49 |
| ▸ | APEX1 | P27695 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.49 |
| ▸ | KCNMA1 | Q12791 | 4/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18360220 | 0.91 | HDAC1 (0.58) | HDAC1HDAC2HDAC3HDAC4HDAC7 | |
| SCHEMBL12510859 | 0.86 | MEN1 (0.52) | HDAC1HDAC2MEN1KMT2AKCNMA1 | |
| SCHEMBL2605585 | 0.85 | HDAC1 (0.70) | HDAC1HDAC2MEN1LMNAPOLB | |
| SCHEMBL19846843 | 0.85 | KCNMA1 (0.62) | HDAC1MEN1LMNAKMT2ATDP1 | |
| SCHEMBL13601067 | 0.83 | HDAC1 (0.86) | HDAC1HDAC2HDAC3MEN1LMNA | |
| SCHEMBL13601069 | 0.83 | HDAC1 (0.67) | HDAC1HDAC2MEN1LMNAPOLB | |
| SCHEMBL16444808 | 0.82 | HDAC1 (0.65) | HDAC1HDAC2MEN1LMNAPOLB | |
| SCHEMBL13958489 | 0.81 | MEN1 (0.66) | HDAC1MEN1LMNAPOLBPKM | |
| SCHEMBL13601076 | 0.80 | HDAC1 (0.63) | HDAC1HDAC2MEN1LMNAPOLB | |
| SCHEMBL26686868 | 0.79 | HDAC1 (0.68) | HDAC1HDAC3HDAC8HDAC6KCNMA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117991590-A | Photosensitive resin composition and photosensitive cured film | 上海八亿时空先进材料有限公司 | 2024-05-07 | — | — | CN | disclosed |
| CN-117964897-A | Alkali-soluble resin and application thereof | 上海八亿时空先进材料有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-116970276-B | Polyimide resin, photosensitive resin composition containing polyimide resin and photosensitive cured film | 上海八亿时空先进材料有限公司 | 2024-01-09 | — | — | CN | disclosed |
| CN-116970276-A | Polyimide resin, photosensitive resin composition containing polyimide resin and photosensitive cured film | 北京八亿时空液晶科技股份有限公司 | 2023-10-31 | — | — | CN | disclosed |
| CN-115343914-A | Alkali-soluble resin, photosensitive resin composition, and photosensitive cured film | 北京八亿时空液晶科技股份有限公司 | 2022-11-15 | — | — | CN | disclosed |
| EP-1744213-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-09-03 | — | — | EP | disclosed |
| EP-2469337-B1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |