SCHEMBL13608495

SCHEMBL13608495

CC(=O)Nc1cc(S(=O)(=O)c2ccc(O)c(NC(C)=O)c2)ccc1O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.56
POLB P06746 2/20 0.54
KDM4E B2RXH2 1/20 0.54
APOBEC3A P31941 1/20 0.54
GFER P55789 1/20 0.54
HDAC1 Q13547 1/20 0.54
APOBEC3G Q9HC16 1/20 0.54
LMNA P02545 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
PHPT1 Q9NRX4 1/20 0.54
CA1 P00915 8/20 0.53
CA2 P00918 8/20 0.53
CA9 Q16790 8/20 0.53
GAA P10253 1/20 0.51
CA12 O43570 4/20 0.49
MAPT P10636 2/20 0.49
PKM P14618 2/20 0.49
RAB9A P51151 1/20 0.49
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9001663 0.88 CASP6 (0.57) NPC1POLBKDM4EAPOBEC3AGFER
SCHEMBL9463617 0.88 CA1 (0.69) CA1CA2CA9CA12MAPT
SCHEMBL5726701 0.85 TDP1 (0.66) NPC1POLBKDM4EAPOBEC3AGFER
SCHEMBL11863660 0.85 CA1 (0.53) NPC1POLBKDM4EAPOBEC3AGFER
SCHEMBL9555211 0.79 TDP1 (0.55) NPC1POLBKDM4EAPOBEC3AGFER
SCHEMBL2605546 0.78 KCNMA1 (0.61) NPC1POLBHDAC1SMN1; SMN2CA1
SCHEMBL11725902 0.77 CA1 (0.77) NPC1HDAC1CA1CA2CA9
SCHEMBL29716471 0.77 LMNA (0.61) NPC1POLBKDM4EAPOBEC3AGFER
SCHEMBL9799672 0.77 LMNA (0.61) NPC1POLBKDM4EAPOBEC3AGFER
SCHEMBL13608493 0.77 HDAC1 (0.83) NPC1POLBKDM4EAPOBEC3AGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7455948-B2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2008-11-25 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed