SCHEMBL13620303

SCHEMBL13620303

CC1=C(C)C(=O)N(OS(=O)(=O)c2c(F)c(F)c(C)c(F)c2F)C1=O

nearest known ligand 0.43

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 6/20 0.43
▸ MAPT P10636 5/20 0.43
▸ HPGD P15428 4/20 0.43
▸ XBP1 P17861 2/20 0.43
▸ CYP1A2 P05177 1/20 0.43
▸ CYP3A4 P08684 1/20 0.43
▸ CYP2C19 P33261 1/20 0.43
▸ NPSR1 Q6W5P4 1/20 0.43
▸ KMT2A Q03164 5/20 0.36
▸ MEN1 O00255 2/20 0.36
▸ VDR P11473 1/20 0.36
▸ ALDH1A1 P00352 5/20 0.33
▸ F2 P00734 3/20 0.33
▸ HTT P42858 2/20 0.33
▸ LMNA P02545 1/20 0.33
▸ SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5551755 0.93 KDM4E (0.41) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL19361374 0.77 KDM4E (0.62) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL14509461 0.71 KMT2A (0.68) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL5556202 0.71 KDM4E (0.50) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL17195062 0.70 KMT2A (0.35) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL2898286 0.70 KMT2A (0.66) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL13952048 0.69 MEN1 (0.32) KDM4EMAPTHPGDXBP1CYP1A2
SCHEMBL503521 0.68 PARL (0.52) KDM4EMAPTHPGDKMT2AMEN1
SCHEMBL4829749 0.68 CA1 (0.33) KMT2AMEN1
SCHEMBL14707486 0.68 VDR (0.36) KDM4EMAPTHPGDXBP1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 — — US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 — — US disclosed
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