SCHEMBL1362672

SCHEMBL1362672

Nc1ccccc1OC(=O)Oc1ccccc1N

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.50
SMN1; SMN2 Q16637 3/20 0.50
TSHR P16473 3/20 0.50
PTGS1 P23219 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
ADRA2B P18089 1/20 0.50
KDM4E B2RXH2 5/20 0.48
MAPT P10636 3/20 0.48
CRHBP P24387 1/20 0.48
CRHR2 Q13324 1/20 0.48
HSD17B10 Q99714 5/20 0.42
HPGD P15428 4/20 0.42
CFTR P13569 1/20 0.42
ALOX15 P16050 2/20 0.41
CYP3A4 P08684 1/20 0.41
CASP1 P29466 1/20 0.41
CASP7 P55210 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9195644 0.87 KDM4E (0.59) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL4385033 0.84 SMN1; SMN2 (0.49) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL32677394 0.84 SMN1; SMN2 (0.49) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL6971578 0.84 SMN1; SMN2 (0.49) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL142738 0.84 SMN1; SMN2 (0.49) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL2865120 0.84 CD44 (0.39) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL32677395 0.84 SMN1; SMN2 (0.49) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL10932991 0.82 ALDH1A1 (0.54) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL27821730 0.82 ELANE (0.46) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1
SCHEMBL362353 0.82 PTGS2 (0.57) ALDH1A1SMN1; SMN2TSHRPTGS1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8067523-B2 Thermosetting resin composition, laminated body using it, and circuit board KANEKA CORPORATION (JP) 2011-11-29 US disclosed
US-7838114-B2 flexible printed circuits; dielectric, flowability, heat resistance, adhesiveness, and processability; a polyimide resin, an monomeric aromatic amine, an epoxy resin (polyepoxide), and an imidazole compound; 1,3-bis(3-aminophenoxy)benzene KANEKA CORPORATION (JP) 2010-11-23 US disclosed
US-20080230261-A1 Thermosetting Resin Composition and Use Thereof KANEKA CORPORATION (JP) 2008-09-25 US disclosed
US-20070074896-A1 Thermosetting resin composition, laminated body using it, and circuit board KANEKA CORPORATION (JP) 2007-04-05 US disclosed
US-6475680-B1 Lithium secondary battery, its electrolyte, and electric apparatus using the same HITACHI, LTD. (JP) 2002-11-05 US disclosed
EP-0944126-A1 Lithium secondary battery, its electrolyte, and electric apparatus using the same Hitachi, Ltd. (JP) 1999-09-22 EP disclosed