SCHEMBL136457

SCHEMBL136457

CC(C)(C)c1ccc(S)c(C(C)(C)C)c1C(C)(C)C

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.32
ALDH1A1 P00352 1/20 0.31
TSHR P16473 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7136409 0.84 CA2 (0.41) CA2ALDH1A1TSHRTDP1
Trifluoromethanesulfonic Acid SCHEMBL668185 0.82 HSD11B1 (0.31)
SCHEMBL10538275 0.79 CA2 (0.48) CA2ALDH1A1TSHRTDP1
SCHEMBL4988860 0.78 CA2 (0.46) CA2ALDH1A1TSHRTDP1
SCHEMBL3742914 0.76 HSD11B1 (0.30)
SCHEMBL31337417 0.75 ALDH1A1 (0.35) CA2ALDH1A1
SCHEMBL270850 0.74 CA1 (0.33) CA2
SCHEMBL6362300 0.73 ALDH1A1 (0.38) CA2ALDH1A1TSHRTDP1
SCHEMBL11357992 0.72 GABRA1 (0.38) CA2ALDH1A1TSHRTDP1
SCHEMBL6061735 0.70 CA2 (0.32) CA2ALDH1A1TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 165 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250147418-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2025-05-08 US disclosed
CN-119330866-A A photoacid generator Photoresist composition comprising the same 湖北鼎龙控股股份有限公司 2025-01-21 CN disclosed
CN-111045296-B UV patternable polymer blend for organic thin film transistor 康宁股份有限公司 2024-12-27 CN disclosed
CN-118511127-A Photosensitive resin composition, method for producing resist pattern film, and method for producing plating molded article JSR株式会社 2024-08-16 CN disclosed
WO-2023157801-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR株式会社 2023-08-24 WO disclosed
EP-3896522-B1 PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 EP disclosed
EP-3896522-A1 PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-20 EP disclosed
US-10423083-B2 Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate JSR CORPORATION (JP) 2019-09-24 US disclosed
EP-2060600-B1 Resist composition, method of forming resist pattern, novel compound, and acid generator TOKYO OHKA KOGYO CO LTD (JP) 2017-12-27 EP disclosed
EP-2325695-B1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2017-12-20 EP disclosed
US-20090047600-A1 high resolution pattern with reduced line edge roughness; increased alkali solubility under action of acid generator TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-19 US disclosed
EP-1953595-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2008-08-06 EP disclosed
EP-1947510-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2008-07-23 EP disclosed
US-20080124648-A1 Resist Pattern Forming Method, Supercritical Processing Solution For Lithography Process, And Antireflection Film Forming Method NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2008-05-29 US disclosed
US-20080118871-A1 Resist Pattern Forming Method NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2008-05-22 US disclosed
US-20080096126-A1 Polymer Compound, Positive Resist Composition and Process for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-24 US disclosed
EP-1806619-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-11 EP disclosed
EP-1757980-A1 Radiation sensitive resin composition JSR Corporation (JP) 2007-02-28 EP disclosed
US-20070042292-A1 Radiation sensitive resin composition JSR CORPORATION (JP) 2007-02-22 US disclosed
US-20040048192-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2004-03-11 US disclosed