SCHEMBL13713627

SCHEMBL13713627

CCCCc1c(F)c(O)c(S(=O)(=O)O)c(F)c1F

nearest known ligand 0.34

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 1/20 0.34
HPGD P15428 2/20 0.33
NPC1 O15118 1/20 0.33
MAPK1 P28482 1/20 0.33
HTT P42858 1/20 0.33
RAB9A P51151 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
KDM4E B2RXH2 2/20 0.32
PKM P14618 1/20 0.32
ESR1 P03372 1/20 0.32
ALDH1A1 P00352 1/20 0.31
HSD17B10 Q99714 1/20 0.31
HCAR2 Q8TDS4 1/20 0.30
ELANE P08246 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9702362 0.90 HCAR2 (0.33) FFAR1HPGDNPC1MAPK1HTT
SCHEMBL8736500 0.83 FAAH (0.35) ALDH1A1
Ammonia Solution, Strong SCHEMBL29155301 0.77 FAAH (0.33) ALDH1A1
SCHEMBL20080940 0.75 CA1 (0.35)
SCHEMBL13925009 0.75 CA2 (0.52)
SCHEMBL5592696 0.73 HPGD (0.45) FFAR1HPGDNPC1MAPK1HTT
SCHEMBL12308132 0.72 CA1 (0.34) KDM4E
SCHEMBL13243398 0.72 S1PR3 (0.37) HPGDMAPK1
SCHEMBL352595 0.71 CA1 (0.44)
SCHEMBL8165780 0.71 NPC1 (0.39) FFAR1HPGDNPC1MAPK1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7592126-B2 Positive resist composition and pattern forming method using the resist composition FUJIFILM CORPORATION (JP) 2009-09-22 US disclosed
US-7465528-B2 Positive-working photosensitive composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2008-12-16 US disclosed
US-7341817-B2 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2008-03-11 US disclosed