Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 3/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | MAPT | P10636 | 2/20 | 0.45 |
| ▸ | MEN1 | O00255 | 2/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.45 |
| ▸ | USP2 | O75604 | 1/20 | 0.45 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.45 |
| ▸ | GAA | P10253 | 1/20 | 0.45 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.45 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.45 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
| ▸ | PNMT | P11086 | 1/20 | 0.41 |
| ▸ | NPC1 | O15118 | 2/20 | 0.41 |
| ▸ | RAB9A | P51151 | 2/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.41 |
| ▸ | APP | P05067 | 1/20 | 0.38 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29800533 | 1.00 | HPGD (0.45) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL20483771 | 0.89 | CYP3A4 (0.43) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL28067835 | 0.87 | KDM4E (0.46) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL30036609 | 0.87 | APP (0.53) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL28847551 | 0.87 | APP (0.53) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL4640228 | 0.87 | ALDH1A1 (0.49) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL30385603 | 0.83 | PNMT (0.38) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL29921844 | 0.83 | TLR8 (0.42) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL29800244 | 0.83 | PGR (0.41) | HPGDKDM4EALDH1A1LMNAMAPT | |
| SCHEMBL5717486 | 0.83 | TLR8 (0.42) | HPGDKDM4EALDH1A1LMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 253 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024216910-A1 | HIGH-CHEMICAL-RESISTANCE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF | 明士(北京)新材料开发有限公司 | 2024-10-24 | — | — | WO | claimed |
| CN-118108661-B | Diamine monomer with nitrogen heterocycle and benzocyclobutene structure, and preparation method and application thereof | 波米科技有限公司 | 2024-09-20 | — | — | CN | claimed |
| CN-118108661-A | Diamine monomer with nitrogen heterocycle and benzocyclobutene structure, and preparation method and application thereof | 波米科技有限公司 | 2024-05-31 | — | — | CN | claimed |
| CN-114524938-B | Polymer, photosensitive resin composition, cured film prepared from polymer and photosensitive resin composition, and electronic element | 江苏三月科技股份有限公司 | 2024-02-09 | — | — | CN | claimed |
| CN-116836389-B | Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-01-26 | — | — | CN | claimed |
| CN-114230792-B | Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116836389-A | Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116149140-B | Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-07-14 | — | — | CN | claimed |
| CN-116068852-B | Positive photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-07-14 | — | — | CN | claimed |
| CN-116149140-A | Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-114995061-B | Low-water-absorption positive photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-01 | — | — | CN | claimed |
| CN-115220305-A | Positive photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-10-21 | — | — | CN | claimed |
| CN-114995061-A | Low-water-absorption positive photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-09-02 | — | — | CN | claimed |
| CN-114524938-A | Polymer, photosensitive resin composition, cured film prepared from same and electronic element | 江苏三月科技股份有限公司 | 2022-05-24 | — | — | CN | claimed |
| WO-2022068900-A1 | POSITIVE PHOTOSENSITIVE POLYAMIDE ESTER RESIN AND COMPOSITION USING SAME | 明士(北京)新材料开发有限公司 | 2022-04-07 | — | — | WO | claimed |
| CN-114230792-A | Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-03-25 | — | — | CN | claimed |
| CN-112876679-A | Positive photosensitive polyamide compound and application thereof | 中节能万润股份有限公司 | 2021-06-01 | — | — | CN | claimed |
| CN-112175182-A | Positive photosensitive polyesteramide resin and composition using same | 明士(北京)新材料开发有限公司 | 2021-01-05 | — | — | CN | claimed |
| CN-111522201-A | Positive photosensitive resin composition, cured film prepared from positive photosensitive resin composition and electronic element | 江苏三月科技股份有限公司 | 2020-08-11 | — | — | CN | claimed |
| CN-109270792-A | A kind of high tenacity, high heat resistance, can weak base water development polyimides/photosensitive epoxy acrylic resin composition | 浙江福斯特新材料研究院有限公司 | 2019-01-25 | — | — | CN | claimed |