Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.49 |
| ▸ | HPGD | P15428 | 3/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.49 |
| ▸ | LMNA | P02545 | 2/20 | 0.49 |
| ▸ | MAPT | P10636 | 2/20 | 0.49 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.49 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.49 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | USP2 | O75604 | 1/20 | 0.49 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.49 |
| ▸ | GAA | P10253 | 1/20 | 0.49 |
| ▸ | HTT | P42858 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | PNMT | P11086 | 1/20 | 0.47 |
| ▸ | APP | P05067 | 1/20 | 0.41 |
| ▸ | NPC1 | O15118 | 2/20 | 0.40 |
| ▸ | RAB9A | P51151 | 2/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.40 |
| ▸ | HTR7 | P34969 | 2/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28067835 | 0.88 | KDM4E (0.46) | ALDH1A1HPGDKDM4ELMNAMAPT | |
| SCHEMBL28454001 | 0.88 | PNMT (0.47) | ALDH1A1HPGDKDM4ELMNAMAPT | |
| SCHEMBL1372572 | 0.87 | HPGD (0.45) | ALDH1A1HPGDKDM4ELMNAMAPT | |
| SCHEMBL29800533 | 0.87 | HPGD (0.45) | ALDH1A1HPGDKDM4ELMNAMAPT | |
| SCHEMBL21295458 | 0.86 | APP (0.58) | PNMTAPPNPC1RAB9AHTR7 | |
| SCHEMBL7805125 | 0.86 | PNMT (0.47) | ALDH1A1HPGDKDM4ELMNAMAPT | |
| SCHEMBL17574470 | 0.82 | ESR2 (0.49) | HSD17B10HSP90AA1PNMTAPPNPC1 | |
| SCHEMBL17574468 | 0.82 | PRKAB2 (0.49) | KDM4ELMNAHSD17B10PNMTAPP | |
| SCHEMBL3366835 | 0.82 | HSD17B1 (0.47) | ALDH1A1HPGDHSD17B10PNMTAPP | |
| SCHEMBL17574464 | 0.82 | PNMT (0.44) | ALDH1A1HPGDKDM4ELMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101291990-B | Thermosetting resin composition and use thereof | NIPPON KAYAKU KK | 2012-05-30 | — | — | CN | claimed |
| CN-101652714-A | Photosensitive resin composition | NIPPON KAYAKU KK JP | 2010-02-17 | — | — | CN | claimed |
| CN-101291990-A | Thermosetting resin composition and use thereof | NIPPON KAYAKU KK (JP) | 2008-10-22 | — | — | CN | claimed |
| CN-113549217-B | Polyimide precursor, resin composition containing same, polyimide resin film, and method for producing same | 旭化成株式会社 | 2024-03-08 | — | — | CN | disclosed |
| US-20240045329-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND | TORAY INDUSTRIES, INC. (JP) | 2024-02-08 | — | — | US | disclosed |
| WO-2023128495-A1 | POLYIMIDE PRECURSOR COMPOSITION WITH IMPROVED FLEXIBILITY AND ELONGATION | 피아이첨단소재 주식회사 | 2023-07-06 | — | — | WO | disclosed |
| CN-115626890-A | Diamine monomer with bulky alkynyl side group and preparation method and application thereof | 波米科技有限公司 | 2023-01-20 | — | — | CN | disclosed |
| CN-108690193-B | Polyimide, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-113549217-A | Polyimide precursor, resin composition containing same, polyimide resin film, and method for producing same | 旭化成株式会社 | 2021-10-26 | — | — | CN | disclosed |
| CN-112940253-A | Polyimide precursor, resin composition, and method for producing resin film | 旭化成株式会社 | 2021-06-11 | — | — | CN | disclosed |
| CN-108026273-B | Polyimide precursor, resin composition, and method for producing resin film | 旭化成株式会社 | 2021-04-06 | — | — | CN | disclosed |
| CN-100481378-C | Laminated body and semiconductor device | JSR CORP SUMITOMO BAKELITE CO (JP) | 2009-04-22 | — | — | CN | disclosed |
| CN-101291990-A | Thermosetting resin composition and use thereof | NIPPON KAYAKU KK (JP) | 2008-10-22 | — | — | CN | disclosed |
| CN-101268119-A | Resin composition, varnish, resin film and semiconductor device | SUMITOMO BAKELITE CO (JP) | 2008-09-17 | — | — | CN | disclosed |
| EP-1953181-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| CN-101213491-A | Photosensitive resin composition and adhesion enhancer | TORAY INDUSTRIES (JP) | 2008-07-02 | — | — | CN | disclosed |
| CN-101128514-A | Benzoxazole resin precursor, polybenzoxazole resin, resin film and semiconductor device | SUMITOMO BAKELITE CO (JP) | 2008-02-20 | — | — | CN | disclosed |
| CN-1957459-A | Laminate and semiconductor device | JSR CORP (JP) | 2007-05-02 | — | — | CN | disclosed |
| CN-1312114-C | Compound of aroma dihydroxy diamines and preparation method | UNIV SHANGHAI JIAOTONG (CN) | 2007-04-25 | — | — | CN | disclosed |
| CN-1660776-A | Compound of aroma dihydroxy diamines and preparation method | UNIV SHANGHAI JIAOTONG (CN) | 2005-08-31 | — | — | CN | disclosed |