SCHEMBL1398359

SCHEMBL1398359

OCNCCNCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1719704 0.95 LMNA (0.38)
SCHEMBL11330423 0.84
SCHEMBL1720393 0.82
SCHEMBL1720385 0.82 CYP1A2 (0.39)
SCHEMBL410349 0.82
SCHEMBL14363062 0.82
SCHEMBL10885036 0.79 CA12 (0.69)
SCHEMBL1627711 0.79
SCHEMBL2058092 0.79 CA12 (0.69)
SCHEMBL15605765 0.79 MAOA (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3037511-B1 SEMI-AQUEOUS PHOTORESIST OR SEMICONDUCTOR MANUFACTURING RESIDUE STRIPPING AND CLEANING COMPOSITION WITH IMPROVED SILICON PASSIVATION VERSUM MAT US LLC (US) 2022-07-06 EP claimed
US-10280189-B2 Method for the synthesis of aminoalkylenephosphonic acid MONSANTO TECHNOLOGY LLC (US) 2019-05-07 US claimed
EP-1031884-B1 Resist stripping agent and process of producing semiconductor devices using the same MITSUBISHI GAS CHEMICAL CO (JP) 2012-01-11 EP claimed
US-7968507-B2 Composition for stripping and stripping method SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-06-28 US claimed
US-20090084406-A1 Composition for stripping and stripping method SAMSUNG ELECTRONICS CO., LTD. 2009-04-02 US claimed
CN-101398639-A Composition for stripping and stripping method SAMSUNG ELECTRONICS CO LTD (KR) 2009-04-01 CN claimed
US-6638694-B2 Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) 2003-10-28 US claimed
EP-1031884-A2 Resist stripping agent and process of producing semiconductor devices using the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2000-08-30 EP claimed
US-20260132062-A1 SIMULTANEOUS CONTROL OF SCALE, CORROSION, AND HYDROGEN SULFIDE-RELATED ISSUES USING A SINGLE PRODUCT CHAMPIONX LLC (US) 2026-05-14 US disclosed
US-20240209234-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR VERSUM MATERIALS US, LLC 2024-06-27 US disclosed
EP-4326678-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR Versum Materials US, LLC (US) 2024-02-28 EP disclosed
CN-116607132-A Plating bath composition for electroless gold plating and method of depositing gold layer 埃托特克德国有限公司 2023-08-18 CN disclosed
WO-2022258518-A1 TITANIUM CATALYST FOR THE POLYESTER MANUFACTURING PROCESS CLARIANT INTERNATIONAL LTD (CH) 2022-12-15 WO disclosed
EP-4101817-A1 NEW TITANIUM CATALYST FOR THE POLYESTER MANUFACTURING PROCESS Clariant International Ltd (CH) 2022-12-14 EP disclosed
US-20050148711-A1 VOC free water reducible coating vehicles VOCFREE, INC. 2005-07-07 US disclosed
US-6730440-B1 Composite body suitable for utilization as a lithium ion battery BASF AKTIENGESELLSCHAFT (DE) 2004-05-04 US disclosed
US-20040048761-A1 Cleaning composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-03-11 US disclosed
US-6638694-B2 Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) 2003-10-28 US disclosed
US-20030186175-A1 RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME IKEMOTO KAZUTO (JP) 2003-10-02 US disclosed
EP-1031884-A2 Resist stripping agent and process of producing semiconductor devices using the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2000-08-30 EP disclosed