SCHEMBL1402877

SCHEMBL1402877

O=S(=O)(c1ccc(SCC2CS2)cc1)c1ccc(SCC2CS2)cc1

nearest known ligand 0.36

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MMP2 P08253 16/20 0.36
MMP9 P14780 16/20 0.36
MMP14 P50281 12/20 0.36
MMP7 P09237 7/20 0.36
MMP8 P22894 7/20 0.36
MMP3 P08254 5/20 0.36
MMP1 P03956 2/20 0.36
ADAM17 P78536 1/20 0.36
CA2 P00918 4/20 0.35
CA12 O43570 3/20 0.35
CA1 P00915 3/20 0.35
CA7 P43166 2/20 0.35
CA13 Q8N1Q1 2/20 0.35
CA4 P22748 1/20 0.34
CA9 Q16790 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1276577 0.84 CRBN (0.33)
SCHEMBL1402573 0.79 MAPT (0.34)
SCHEMBL4645049 0.76 MMP2 (0.38) MMP2MMP9MMP14MMP7MMP8
SCHEMBL7181937 0.76
SCHEMBL1402789 0.75 LMNA (0.51) CA2CA12CA1CA7CA13
SCHEMBL1778553 0.75 ALDH1A1 (0.46) MMP2MMP9MMP14MMP7MMP8
SCHEMBL2786852 0.74 ALDH1A1 (0.43) MMP2MMP9MMP14MMP7MMP8
SCHEMBL4645061 0.72
SCHEMBL4647523 0.72 MMP2 (0.43) MMP2MMP9MMP14MMP7MMP8
SCHEMBL4863194 0.71 MAPT (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2963457-B1 OPTICAL MATERIAL, COMPOSITION FOR USE THEREIN, AND USE THEREOF MITSUI CHEMICALS INC (JP) 2018-07-11 EP claimed
CN-113166311-B Composition for optical material and optical material 株式会社德山 2023-01-06 CN disclosed
CN-107428040-B Method for manufacturing plastic lens, method for positioning film, and composite body 株式会社HOPNIC研究所 2022-05-31 CN disclosed
US-20220056170-A1 OPTICAL MATERIAL COMPOSITION AND OPTICAL MATERIAL TOKUYAMA CORPORATION (JP) 2022-02-24 US disclosed
US-20210372984-A1 METHOD FOR SETTING POLYMERIZATION CONDITION AND METHOD FOR MANUFACTURING OPTICAL MATERIAL MITSUI CHEMICALS, INC. (JP) 2021-12-02 US disclosed
EP-3901184-A1 OPTICAL MATERIAL COMPOSITION AND OPTICAL MATERIAL Tokuyama Corporation (JP) 2021-10-27 EP disclosed
CN-113166311-A Composition for optical material and optical material 株式会社德山 2021-07-23 CN disclosed
CN-108026277-B Polymerizable composition for optical material, method for producing polymerizable composition for optical material, and method for producing optical material 三井化学株式会社 2021-07-16 CN disclosed
EP-2123695-B1 METAL THIETANE COMPOUND, POLYMERIZABLE COMPOSITION COMPRISING THE COMPOUND, RESIN, AND USE OF THE RESIN MITSUI CHEMICALS INC (JP) 2021-06-23 EP disclosed
EP-3828224-A1 METHOD FOR SETTING POLYMERIZATION CONDITIONS AND METHOD FOR PRODUCING OPTICAL MATERIAL Mitsui Chemicals, Inc. (JP) 2021-06-02 EP disclosed
US-6596841-B2 For producing resin which is used for optical material such as a plastic lens, a prism, an optical fiber, a substrate for an information recording medium, a filter and a light emitting diodes; refractive index MITSUI CHEMICALS, INC. (JP) 2003-07-22 US disclosed
CN-1397589-A Prodn. method of optical material MITSUBISHI GAS KASEI CO LTD (JP) 2003-02-19 CN disclosed
US-6458917-B2 CURABLE; POLYSULFIDES MITSUI CHEMICALS, INC. (JP) 2002-10-01 US disclosed
US-20020022713-A1 Polythiol, polymerizable composition, resin and lens, and process for preparing thiol compound MITSUI CHEMICALS, INC. (JP) 2002-02-21 US disclosed
US-20020019511-A1 Polymerizable composition MORIJIRI HIROYUKI (JP) 2002-02-14 US disclosed
US-6300464-B2 HIGH HEAT RESISTANCE AND REFRACTIVE INDEX, LOW SPECIFIC GRAVITY; POLYMERS CONTAINING THIO(EPOXY) AND AT LEAST ONE DISULFIDE BOND MITSUI CHEMICAL, INC. (JP) 2001-10-09 US disclosed
EP-1138670-A1 Polythiol, polymerizable composition, resin and lens, and process for preparing thiol compound Mitsui Chemicals, Inc. (JP) 2001-10-04 EP disclosed
US-20010002413-A1 Polymerizable composition MORIJIRI HIROYUKI (JP) 2001-05-31 US disclosed
US-6204311-B1 (THIO)EPOXY COMPOUND HAVING AT LEAST ONE INTRAMOLECULAR DISULFIDE BOND AND A CURING CATALYST. MITSUI CHEMICALS, INC. (JP) 2001-03-20 US disclosed
EP-0942027-A2 A polymerizable composition Mitsui Chemicals, Inc. (JP) 1999-09-15 EP disclosed