SCHEMBL14030980

SCHEMBL14030980

CCOCOc1ccccc1NC(=O)c1ccc(C(C)(C)CC)cc1

nearest known ligand 0.64

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 3/20 0.52
▸ GAA P10253 3/20 0.52
▸ MEN1 O00255 3/20 0.52
▸ KMT2A Q03164 3/20 0.52
▸ NPC1 O15118 2/20 0.52
▸ PTK2 Q05397 1/20 0.52
▸ ALDH1A1 P00352 1/20 0.51
▸ P4HTM Q9NXG6 1/20 0.49
▸ AHR P35869 1/20 0.49
▸ SMN1; SMN2 Q16637 1/20 0.47
▸ HTT P42858 1/20 0.47
▸ POLB P06746 2/20 0.46
▸ HDAC1 Q13547 1/20 0.46
▸ HDAC8 Q9BY41 1/20 0.46
▸ HDAC6 Q9UBN7 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5031620 0.83 GAA (0.54) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL413038 0.81 NPC1 (0.61) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL14031075 0.81 RAB9A (0.52) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL14030937 0.80 KMT2A (0.54) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL7300821 0.80 RAB9A (0.66) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL10027965 0.79 GAA (0.50) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL14030971 0.77 NPC1 (0.59) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL10027983 0.76 NPC1 (0.55) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL8970981 0.75 PTK2 (0.70) RAB9AGAAMEN1KMT2ANPC1
SCHEMBL1876356 0.74 HTT (0.59) GAAMEN1KMT2AALDH1A1AHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7439005-B2 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2008-10-21 — — US disclosed
US-20070134586-A1 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2007-06-14 — — US disclosed
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