SCHEMBL14130423

SCHEMBL14130423

Cc1ccc(OC(=O)c2cc(C(=O)Oc3ccc(C)cc3/N=N/c3ccccc3)cc(C(=O)Oc3ccc(C)cc3/N=N/c3ccccc3)c2)c(/N=N/c2ccccc2)c1

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ FTO Q9C0B1 1/20 0.55
▸ MAPT P10636 4/20 0.45
▸ RAB9A P51151 2/20 0.45
▸ L3MBTL1 Q9Y468 2/20 0.45
▸ CASP3 P42574 1/20 0.45
▸ SENP8 Q96LD8 1/20 0.45
▸ SENP7 Q9BQF6 1/20 0.45
▸ SENP6 Q9GZR1 1/20 0.45
▸ NPC1 O15118 2/20 0.41
▸ HTT P42858 1/20 0.41
▸ KMT2A Q03164 2/20 0.40
▸ MAPK1 P28482 1/20 0.40
▸ THRB P10828 1/20 0.40
▸ TRPA1 O75762 1/20 0.40
▸ MAOB P27338 1/20 0.40
▸ MEN1 O00255 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14130203 0.93 MAPT (0.55) FTOMAPTRAB9AL3MBTL1CASP3
SCHEMBL14130187 0.85 SERPINE1 (0.47) FTOMAPTRAB9AL3MBTL1CASP3
SCHEMBL13609821 0.82 FTO (0.54) FTOMAPTRAB9AL3MBTL1CASP3
SCHEMBL6451518 0.80 FTO (0.63) FTOMAPTRAB9AL3MBTL1CASP3
SCHEMBL14130172 0.80 KMT2A (0.46) MAPTRAB9AL3MBTL1CASP3SENP8
SCHEMBL30894899 0.79 FTO (0.60) FTOMAPTRAB9AL3MBTL1NPC1
SCHEMBL30894900 0.79 FTO (0.60) FTOMAPTRAB9AL3MBTL1NPC1
SCHEMBL14130431 0.76 MAPT (0.58) MAPTRAB9AL3MBTL1CASP3SENP8
SCHEMBL14130409 0.75 KMT2A (0.50) MAPTRAB9AL3MBTL1CASP3SENP8
SCHEMBL14130179 0.75 TDP1 (0.51) MAPTRAB9AL3MBTL1CASP3SENP8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080161532-A1 COMPOSITION FOR FORMING LOW-DIELECTRIC-CONSTANT FILM, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-07-03 — — US disclosed
US-20080161532-A1 COMPOSITION FOR FORMING LOW-DIELECTRIC-CONSTANT FILM, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-07-03 — — US disclosed
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