SCHEMBL14747377

SCHEMBL14747377

CCC(C)(C)C(=O)Oc1ccc(C(C)(C)O)cc1

nearest known ligand 0.51

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ELANE P08246 13/20 0.51
TDP1 Q9NUW8 2/20 0.39
MAPT P10636 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
BCHE P06276 2/20 0.39
CHRM2 P08172 1/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
HRH3 Q9Y5N1 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27428780 0.88 ELANE (0.50) ELANETDP1MAPTL3MBTL1BCHE
SCHEMBL15179672 0.88 ELANE (0.50) ELANETDP1MAPTL3MBTL1BCHE
SCHEMBL107059 0.88 ELANE (0.53) ELANETDP1MAPTL3MBTL1MEN1
SCHEMBL17809598 0.86 ELANE (0.42) ELANEL3MBTL1
SCHEMBL15179661 0.85 ELANE (0.59) ELANETDP1MAPTL3MBTL1BCHE
SCHEMBL15495793 0.85 ELANE (0.50) ELANE
SCHEMBL12737001 0.84 ELANE (0.56) ELANETDP1KMT2ASMN1; SMN2
SCHEMBL13059563 0.84 ELANE (0.47) ELANESMN1; SMN2
SCHEMBL19164737 0.84 ELANE (0.47) ELANETDP1MAPTL3MBTL1BCHE
SCHEMBL10115670 0.84 HSD11B1 (0.48) ELANE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180180998-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-06-28 US disclosed
US-9971245-B2 Silicon-containing polymer, silicon-containing compound, composition for forming a resist under layer film, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-15 US disclosed
US-9904169-B2 Photomask blank, resist pattern forming process, and method for making photomask SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-27 US disclosed
US-20180039175-A1 NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-08 US disclosed
US-9740098-B2 Chemically amplified negative resist composition using novel onium salt and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-08-22 US disclosed
US-9645493-B2 Negative resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-09 US disclosed
US-20170121437-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND MASK BLANK FUJIFILM CORPORATION (JP) 2017-05-04 US disclosed
US-9632417-B2 Shrink material and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-25 US disclosed
US-20160299428-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION USING NOVEL ONIUM SALT AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-10-13 US disclosed
US-20160299430-A1 NEGATIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-10-13 US disclosed
US-20160299431-A1 PHOTOMASK BLANK, RESIST PATTERN FORMING PROCESS, AND METHOD FOR MAKING PHOTOMASK SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-10-13 US disclosed
US-20160229939-A1 SILICON-CONTAINING POLYMER, SILICON-CONTAINING COMPOUND, COMPOSITION FOR FORMING A RESIST UNDER LAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-11 US disclosed
US-20160161851-A1 SHRINK MATERIAL AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-09 US disclosed
US-9244348-B2 Chemically amplified negative resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-01-26 US disclosed
US-20130209922-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS INTERNATIONAL BUSINESS MACHINES CORPORATION 2013-08-15 US disclosed
US-8389200-B2 Pattern forming method FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180180998-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SLC11A2, POLR2B, POLI ELANE 2693/4885TDP1 3880/4885MAPT 3178/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.