⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10070949 | 0.82 | — | — | |
| SCHEMBL1476763 | 0.81 | — | — | |
| SCHEMBL1476790 | 0.74 | THRB (0.31) | — | |
| SCHEMBL21790384 | 0.74 | — | — | |
| SCHEMBL16626031 | 0.72 | ALDH1A1 (0.32) | — | |
| SCHEMBL1476332 | 0.72 | ALDH1A1 (0.32) | — | |
| SCHEMBL22229073 | 0.72 | — | — | |
| SCHEMBL1477027 | 0.72 | ALDH1A1 (0.37) | — | |
| SCHEMBL22229074 | 0.72 | — | — | |
| SCHEMBL22096237 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6916890-B1 | Thermally reworkable epoxy resins and compositions based thereon | HENKEL CORPORATION (US) | 2005-07-12 | — | — | US | claimed |
| WO-2003031492-A1 | THERMALLY REWORKABLE EPOXY RESINS AND COMPOSITIONS BASED THEREO N | HENKEL CORPORATION (US) | 2003-04-17 | — | — | WO | claimed |
| US-5486545-A | SOLVENT RESISTANCE | RENSSELAER POLYTECHNIC INSTITUTE (US) | 1996-01-23 | — | — | US | claimed |
| EP-2813892-B1 | Photoresist underlayer film-forming composition and pattern forming processes | SHINETSU CHEMICAL CO (JP) | 2020-06-17 | — | — | EP | disclosed |
| US-10228621-B2 | Underlayer film-forming composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-03-12 | — | — | US | disclosed |
| US-10156788-B2 | Resist underlayer film composition, patterning process, and compound | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-12-18 | — | — | US | disclosed |
| EP-2813890-B1 | Photoresist underlayer film-forming composition and pattern forming processes | SHINETSU CHEMICAL CO (JP) | 2018-05-30 | — | — | EP | disclosed |
| US-9984878-B2 | Resist under layer film composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-29 | — | — | US | disclosed |
| US-9899218-B2 | Resist under layer film composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-02-20 | — | — | US | disclosed |
| EP-2813889-B1 | Photoresist underlayer film-forming composition and pattern forming process | SHINETSU CHEMICAL CO (JP) | 2018-02-07 | — | — | EP | disclosed |
| EP-2813891-B1 | Photoresist underlayer film-forming composition and pattern forming process | SHINETSU CHEMICAL CO (JP) | 2018-01-17 | — | — | EP | disclosed |
| US-7271219-B2 | Useful as overcoating materials and interlayer insulating materials for wiring boards | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-09-18 | — | — | US | disclosed |
| US-20060162771-A1 | Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2006-07-27 | — | — | US | disclosed |
| US-7009009-B1 | Fluxing underfill compositions | HENKEL CORPORATION (US) | 2006-03-07 | — | — | US | disclosed |
| EP-1598897-A1 | SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME | Nippon Kayaku Kabushiki Kaisha (JP) | 2005-11-23 | — | — | EP | disclosed |
| US-6916890-B1 | Thermally reworkable epoxy resins and compositions based thereon | HENKEL CORPORATION (US) | 2005-07-12 | — | — | US | disclosed |
| US-20040102601-A1 | Useful as overcoating materials and interlayer insulating materials for wiring boards | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-05-27 | — | — | US | disclosed |
| EP-1375553-A1 | CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-6667194-B1 | Method of bonding die chip with underfill fluxing composition | HENKEL LOCTITE CORPORATION | 2003-12-23 | — | — | US | disclosed |
| WO-2003031492-A1 | THERMALLY REWORKABLE EPOXY RESINS AND COMPOSITIONS BASED THEREO N | HENKEL CORPORATION (US) | 2003-04-17 | — | — | WO | disclosed |