Water

Water

SCHEMBL147699

CCCCC[S+](CCCCC)CCCCC.[OH-]

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ

The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.47
THRB P10828 1/20 0.47
LMNA P02545 3/20 0.40
SLC22A1 O15245 3/20 0.37
SLC22A2 O15244 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
DNM1 Q05193 5/20 0.35
ALDH1A1 P00352 3/20 0.35
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
HSD17B10 Q99714 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL39345 0.96 TSHR (0.50) TSHRTHRBLMNASLC22A1SLC22A2
SCHEMBL3787683 0.93 TSHR (0.57) TSHRTHRBLMNASLC22A1DNM1
Hydrochloric Acid SCHEMBL465434 0.93 TSHR (0.47) TSHRTHRBLMNASLC22A1SLC22A2
SCHEMBL4238292 0.93 TSHR (0.47) TSHRTHRBLMNASLC22A1SLC22A2
SCHEMBL1171556 0.93 TSHR (0.57) TSHRTHRBLMNASLC22A1DNM1
SCHEMBL3791346 0.93 TSHR (0.57) TSHRTHRBLMNASLC22A1DNM1
SCHEMBL3199493 0.93 TSHR (0.57) TSHRTHRBLMNASLC22A1DNM1
Bromide SCHEMBL3256197 0.93 TSHR (0.47) TSHRTHRBLMNASLC22A1SLC22A2
Hydrochloric Acid SCHEMBL11671892 0.90 TSHR (0.53) TSHRTHRBLMNASLC22A1DNM1
SCHEMBL4231002 0.90 TSHR (0.44) TSHRTHRBLMNASLC22A1SLC22A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 914 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240231230-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-07-11 US disclosed
US-12013644-B2 Method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-06-18 US disclosed
US-12001140-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-06-04 US disclosed
CN-117940850-A Composition for forming silicon-containing resist underlayer film, laminate using same, and method for producing semiconductor element 日产化学株式会社 2024-04-26 CN disclosed
WO-2024070963-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE 富士フイルム株式会社 2024-04-04 WO disclosed
US-20240103374-A1 TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2024-03-28 US disclosed
WO-2024063044-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-03-28 WO disclosed
EP-3614206-B1 PHOTOSENSITIVE COMPOSITION FOR EUV LIGHT, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE FUJIFILM CORP (JP) 2024-03-13 EP disclosed
EP-3385791-B1 PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, LAMINATE FILM, AND UPPER LAYER FILM FORMATION COMPOSITION FUJIFILM CORP (JP) 2024-02-28 EP disclosed
US-11892775-B2 Storage container storing treatment liquid for manufacturing semiconductor FUJIFILM CORPORATION (JP) 2024-02-06 US disclosed
EP-1367439-A1 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-12-03 EP disclosed
EP-1353225-A2 Radiation sensitive composition and compound FUJI PHOTO FILM CO., LTD. (JP) 2003-10-15 EP disclosed
US-20030186161-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-10-02 US disclosed
US-20030148206-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-08-07 US disclosed
EP-1300727-A2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-04-09 EP disclosed
US-20030044717-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-03-06 US disclosed
US-20030017415-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-01-23 US disclosed
US-20030010748-A1 Positive photosensitive compositions FUJI PHOTO FILM CO., LTD. 2003-01-16 US disclosed
EP-1273970-A2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-01-08 EP disclosed
EP-1260864-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2002-11-27 EP disclosed