Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.30 |
| ▸ | G6PD | P11413 | 1/20 | 0.30 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.30 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9404264 | 0.89 | LMNA (0.30) | TSHRLMNAALOX12ACHE | |
| SCHEMBL15637037 | 0.82 | TSHR (0.33) | TSHRLMNAALOX12ACHEGAA | |
| SCHEMBL9306680 | 0.78 | LMNA (0.30) | TSHRLMNAALOX12ACHE | |
| SCHEMBL17885704 | 0.78 | APOBEC3A (0.31) | TSHRLMNAALOX12ACHE | |
| SCHEMBL6440299 | 0.78 | APOBEC3A (0.31) | TSHRLMNAALOX12ACHE | |
| SCHEMBL9638266 | 0.76 | TSHR (0.32) | TSHR | |
| SCHEMBL17885703 | 0.76 | CYP2B6 (0.30) | — | |
| Ammonia Solution, Strong SCHEMBL27725623 | 0.74 | — | — | |
| SCHEMBL1159877 | 0.72 | HTR2C (0.36) | TSHRLMNA | |
| SCHEMBL38659934 | 0.72 | LMNA (0.30) | TSHRLMNAALOX12ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | claimed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | claimed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| WO-2025034650-A1 | RF PULSING ASSISTED LOW-K DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | WO | claimed |
| US-20250054749-A1 | RF PULSING ASSISTED LOW-K FILM DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | US | claimed |
| US-20260018409-A1 | POST TREATMENT PROCESSES | APPLIED MATERIALS INC (US) | 2026-01-15 | — | — | US | disclosed |
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | disclosed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | disclosed |
| US-20250369102-A1 | LOWER K AND HIGHER HARDNESS WITH IMPROVED PLASMA INDUCED DAMAGE (PID) DIELECTRIC FILM DEPOSITION | APPLIED MATERIALS INC (US) | 2025-12-04 | — | — | US | disclosed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | disclosed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | disclosed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | disclosed |
| US-20250054749-A1 | RF PULSING ASSISTED LOW-K FILM DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | US | disclosed |
| WO-2025034650-A1 | RF PULSING ASSISTED LOW-K DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | WO | disclosed |
| US-20110077364-A1 | COMPOSITION CONTAINING SILICON-CONTAINING POLYMER, CURED PRODUCT OF THE COMPOSITION, SILICON-CONTAINING POLYMER, AND METHOD OF PRODUCING THE SILICON-CONTAINING POLYMER | JSR CORPORATION (JP) | 2011-03-31 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260018409-A1 | POST TREATMENT PROCESSES | PIEZO1, CDH1, ITK | TSHR 4473/4885LMNA 69/4885ALOX12 1030/4885 |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | ITK, PARG, C9 | TSHR 3829/4885LMNA 21/4885ALOX12 986/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.