SCHEMBL150087

SCHEMBL150087

C=C(CCCOc1cc(Cl)c(Cl)c(Cl)c1Cl)C(=O)O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.38
RAB9A P51151 3/20 0.37
NPC1 O15118 2/20 0.36
HPGD P15428 4/20 0.35
TSHR P16473 3/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
NLRP1 Q9C000 1/20 0.35
TP53 P04637 2/20 0.34
KDM4E B2RXH2 2/20 0.34
ALDH1A1 P00352 2/20 0.34
MAPK1 P28482 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
LMNA P02545 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
GAA P10253 2/20 0.33
PTGDR2 Q9Y5Y4 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2C19 P33261 1/20 0.33
ALOX15 P16050 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL150944 0.85 MRGPRX4 (0.44) MAPTRAB9ANPC1HPGDTSHR
SCHEMBL9489300 0.72 TDP1 (0.56) MAPTHPGDTSHRTP53KDM4E
SCHEMBL3067810 0.70 KMT2A (0.52) RAB9AHPGDALDH1A1L3MBTL1LMNA
SCHEMBL15169353 0.70 THRB (0.49) HPGDTSHRSMN1; SMN2TP53KDM4E
SCHEMBL148282 0.70 TDP1 (0.39) TSHRSMN1; SMN2KDM4EALDH1A1L3MBTL1
SCHEMBL11230917 0.70 AKR1B1 (0.41) HPGDTSHRMAPK1LMNATDP1
SCHEMBL449703 0.69 THRA (0.44) SMN1; SMN2KDM4EALDH1A1LMNATDP1
SCHEMBL4836971 0.69 GAA (0.55) MAPTRAB9ANPC1HPGDTSHR
SCHEMBL9001338 0.69 MEN1 (0.54) RAB9ANPC1HPGDTSHRSMN1; SMN2
SCHEMBL28414797 0.69 KDM4E (0.60) MAPTRAB9ANPC1HPGDSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10591816-B2 Photosensitive resin composition, color filter, and liquid crystal display element thereof CHI MEI CORPORATION (TW) 2020-03-17 US disclosed
US-9939568-B2 Photosensitive resin composition for color filter and application of the same CHI MEI CORPORATION (TW) 2018-04-10 US disclosed
US-20180004086-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF SPACER, PRODUCTION METHOD OF PROTECTION FILM, AND LIQUID CRYSTAL DISPLAY DEVICE CHI MEI CORPORATION (TW) 2018-01-04 US disclosed
US-20170235224-A1 PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT THEREOF CHI MEI CORPORATION (TW) 2017-08-17 US disclosed
US-9676899-B2 Radiation curable resin composition and rapid three dimensional imaging process using the same DSM IP ASSETS B.V. (NL) 2017-06-13 US disclosed
US-9557444-B2 Alkali-soluble resin, photosensitive resin composition, color filter, method for manufacturing the same, and liquid crystal display apparatus CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
US-9557443-B2 Photosensitive resin composition, black matrix, color filter, and liquid crystal display device CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
US-20170003586-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2017-01-05 US disclosed
US-9529116-B2 Photosensitive resin composition and application of the same CHI MEI CORPORATION (TW) 2016-12-27 US disclosed
US-9519208-B2 Photosensitive resin composition for color filters and uses thereof CHI MEI CORPORATION (TW) 2016-12-13 US disclosed
US-20080064780-A1 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2008-03-13 US disclosed
US-20070238047-A1 Photosensitive resin composition for color filters CHI-MEI CORPORATION 2007-10-11 US disclosed
US-20070232713-A1 Radiation Curable Liquid Resin Composition for Optical Three-Dimensional Molding and Optical Molded Article Obtained by Photocuring Same JSR CORPORATION (JP) 2007-10-04 US disclosed
US-20070043138-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA 2007-02-22 US disclosed
US-20060172230-A1 hazardous waste reduction in stereolithography; nonhazardous: photosensitizer 4-benzoyl-4-methyldiphenyl sulfide, photoacid diffusion inhibitor, an oxetane, and boron containing cationic photoinitiator; fluorinated surfactants or polymers increase curing rate; antimony-free DSM IP ASSETS B.V. (NL) 2006-08-03 US disclosed
US-20050287470-A1 Curable compositions and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2005-12-29 US disclosed
US-20050209357-A1 Flame retardant radiation curable compositions DSM IP ASSETS B.V. (NL) 2005-09-22 US disclosed
US-20050175930-A1 Photosensitive resin composition for black matrix CHI MEI CORPORATION (TW) 2005-08-11 US disclosed
US-20050171255-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA (JP) 2005-08-04 US disclosed
US-20050158659-A1 Photosensitive resin composition for black matrix CHI MEI CORPORATION (TW) 2005-07-21 US disclosed