SCHEMBL148282

SCHEMBL148282

C=C(CCCOc1cc(Br)c(Br)c(Br)c1Br)C(=O)O

nearest known ligand 0.40

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.39
TSHR P16473 2/20 0.38
KDM4E B2RXH2 8/20 0.36
SMN1; SMN2 Q16637 3/20 0.36
ALDH1A1 P00352 2/20 0.36
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
GAA P10253 2/20 0.36
LMNA P02545 1/20 0.36
USP2 O75604 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.34
HSD17B10 Q99714 1/20 0.33
NPY1R P25929 1/20 0.33
NPY2R P49146 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C9 P11712 1/20 0.33
CYP2C19 P33261 1/20 0.33
AKR1B1 P15121 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL150208 0.85 TDP1 (0.38) TDP1TSHRKDM4ESMN1; SMN2ALDH1A1
SCHEMBL453710 0.78 HTR1B (0.52) TDP1KDM4ESMN1; SMN2ALDH1A1MEN1
SCHEMBL3787371 0.77 TDP1 (0.36) TDP1KDM4ESMN1; SMN2ALDH1A1MEN1
SCHEMBL452884 0.77 KDM4E (0.53) KDM4ESMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL449703 0.75 THRA (0.44) TDP1KDM4ESMN1; SMN2ALDH1A1MEN1
SCHEMBL11542962 0.74 TDP1 (0.61) TDP1KDM4ESMN1; SMN2ALDH1A1L3MBTL1
SCHEMBL3177108 0.72 THRA (0.38) KDM4EALDH1A1MEN1KMT2ANPY1R
SCHEMBL3187267 0.70 RAB9A (0.49) KDM4ESMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL15169906 0.70 THRB (0.49) TDP1TSHRKDM4ESMN1; SMN2ALDH1A1
SCHEMBL150087 0.70 MAPT (0.38) TDP1TSHRKDM4ESMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10591816-B2 Photosensitive resin composition, color filter, and liquid crystal display element thereof CHI MEI CORPORATION (TW) 2020-03-17 US disclosed
US-9939568-B2 Photosensitive resin composition for color filter and application of the same CHI MEI CORPORATION (TW) 2018-04-10 US disclosed
US-20170235224-A1 PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT THEREOF CHI MEI CORPORATION (TW) 2017-08-17 US disclosed
US-9676899-B2 Radiation curable resin composition and rapid three dimensional imaging process using the same DSM IP ASSETS B.V. (NL) 2017-06-13 US disclosed
US-9557443-B2 Photosensitive resin composition, black matrix, color filter, and liquid crystal display device CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
US-9557444-B2 Alkali-soluble resin, photosensitive resin composition, color filter, method for manufacturing the same, and liquid crystal display apparatus CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
US-20170003586-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2017-01-05 US disclosed
US-9529116-B2 Photosensitive resin composition and application of the same CHI MEI CORPORATION (TW) 2016-12-27 US disclosed
US-9519208-B2 Photosensitive resin composition for color filters and uses thereof CHI MEI CORPORATION (TW) 2016-12-13 US disclosed
US-20160327863-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTER AND APPLICATION OF THE SAME CHI MEI CORPORATION (TW) 2016-11-10 US disclosed
US-20070232713-A1 Radiation Curable Liquid Resin Composition for Optical Three-Dimensional Molding and Optical Molded Article Obtained by Photocuring Same JSR CORPORATION (JP) 2007-10-04 US disclosed
US-20070043138-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA 2007-02-22 US disclosed
US-20060194038-A1 Abrasive articles and methods for making same SAINT-GOBAIN ABRASIVES, INC. (US) 2006-08-31 US disclosed
US-20060172230-A1 hazardous waste reduction in stereolithography; nonhazardous: photosensitizer 4-benzoyl-4-methyldiphenyl sulfide, photoacid diffusion inhibitor, an oxetane, and boron containing cationic photoinitiator; fluorinated surfactants or polymers increase curing rate; antimony-free DSM IP ASSETS B.V. (NL) 2006-08-03 US disclosed
US-20050287470-A1 Curable compositions and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2005-12-29 US disclosed
US-20050209357-A1 Flame retardant radiation curable compositions DSM IP ASSETS B.V. (NL) 2005-09-22 US disclosed
US-20050175930-A1 Photosensitive resin composition for black matrix CHI MEI CORPORATION (TW) 2005-08-11 US disclosed
US-20050171255-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA (JP) 2005-08-04 US disclosed
US-20050158659-A1 Photosensitive resin composition for black matrix CHI MEI CORPORATION (TW) 2005-07-21 US disclosed
US-20050101684-A1 Curable compositions and rapid prototyping process using the same YOU XIAORONG (US) 2005-05-12 US disclosed