SCHEMBL1506780

SCHEMBL1506780

C=Cc1cc(O)cc2ccccc12

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NQO2 P16083 1/20 0.55
ESR1 P03372 4/20 0.51
ESR2 Q92731 4/20 0.51
ALDH1A1 P00352 3/20 0.48
KDM4E B2RXH2 2/20 0.48
MEN1 O00255 2/20 0.48
HPGD P15428 2/20 0.48
KMT2A Q03164 2/20 0.48
MAPT P10636 1/20 0.48
MPI P34949 1/20 0.48
TRPM4 Q8TD43 1/20 0.42
CDC25B P30305 3/20 0.41
CYP1A2 P05177 3/20 0.40
ESRRB O95718 1/20 0.40
ESRRA P11474 1/20 0.40
HSD17B10 Q99714 2/20 0.37
HIF1A Q16665 1/20 0.37
CYP1B1 Q16678 1/20 0.37
PTGS1 P23219 2/20 0.37
ERN1 O75460 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formamide SCHEMBL9732527 0.91 NQO2 (0.47) NQO2ESR1ESR2ALDH1A1KDM4E
SCHEMBL29953364 0.80 NQO2 (0.55) NQO2ESR1ESR2ALDH1A1KDM4E
SCHEMBL3268303 0.80 NQO2 (0.55) NQO2ESR1ESR2ALDH1A1KDM4E
SCHEMBL1506789 0.78 CYP1A2 (0.43) NQO2ESR1ESR2MEN1KMT2A
SCHEMBL30365636 0.78 CYP1A2 (0.43) NQO2ESR1ESR2MEN1KMT2A
SCHEMBL29434181 0.78 ALDH1A1 (0.41) NQO2ESR1ESR2ALDH1A1MEN1
SCHEMBL258189 0.78 ALDH1A1 (0.41) NQO2ESR1ESR2ALDH1A1MEN1
SCHEMBL25165569 0.77 NQO2 (0.52) NQO2ESR1ESR2ALDH1A1KDM4E
SCHEMBL17988291 0.77 NQO2 (0.52) NQO2ALDH1A1KDM4EMEN1HPGD
SCHEMBL31180384 0.77 TRPM4 (0.46) ALDH1A1KDM4EMEN1HPGDKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119731268-A Thermoplastic resin composition and molded article 大科能宇菱通株式会社 2025-03-28 CN disclosed
US-9846360-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-19 US disclosed
US-9760010-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-12 US disclosed
US-9760010-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-12 US disclosed
US-9568821-B2 Patterning process SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-02-14 US disclosed
US-9568821-B2 Patterning process SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-02-14 US disclosed
US-9551928-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern therewith FUJIFILM CORPORATION (JP) 2017-01-24 US disclosed
US-20170003590-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-05 US disclosed
US-20160363866-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-15 US disclosed
US-9507262-B2 Resist top-coat composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-11-29 US disclosed
US-7510820-B2 Resist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-03-31 US disclosed
US-7510820-B2 Resist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-03-31 US disclosed
US-20090011199-A1 Fluorine-Containing Compound, Fluorine-Containing Polymer, Negative-Type Resist Composition, and Patterning Process Using Same CENTRAL GLASS COMPANY, LIMITED (JP) 2009-01-08 US disclosed
US-20070122740-A1 Resist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
US-20070122740-A1 Resist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
EP-0849634-B1 Radiation sensitive resin composition JSR CORP (JP) 2004-03-31 EP disclosed
US-6322949-B2 SULFONIUM COMPOUND AS PHOTOACID GENERATOR JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-11-27 US disclosed
US-20010014427-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-08-16 US disclosed
US-6187504-B1 PHOTOSENSITIVE BLEND CONTAINING A NAPHTHALENE SULFONIUM SULFONATE DERIVATIVE PHOTOACID GENERATOR, RESIN HAVING ALKALI INSOLUBLE GROUPS CLEAVABLE BY ACID, AN ALKALI SOLUBLE RESIN AND A SOLUBILITY CONTROL AGENT; POSITIVES, RESOLUTION JSR CORPORATION (JP) 2001-02-13 US disclosed
EP-0849634-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-06-24 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090011199-A1 Fluorine-Containing Compound, Fluorine-Containing Polymer, Negative-Type Resist Composition, and Patterning Process Using Same FGFR2, RTF1, ADGRF1 NQO2 3520/4885ESR1 334/4885ESR2 1056/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.