SCHEMBL150988

SCHEMBL150988

C=CC[C]1C2CC3CC(C2)CC1C3

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL39663 0.67 TSHR (0.32) TSHR
SCHEMBL27517386 0.65 TSHR (0.31) TSHR
SCHEMBL249250 0.64
Adamantane SCHEMBL2284749 0.64 ALDH1A1 (0.60)
SCHEMBL4791985 0.62 TSHR (0.43) TSHR
SCHEMBL190681 0.62 HSD11B1 (0.31)
SCHEMBL4885472 0.62
SCHEMBL27509111 0.60
SCHEMBL5668438 0.60
SCHEMBL10774077 0.60 TSHR (0.35) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1579 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10301515-B2 Easily dismantlable adhesive composition and easily dismantlable adhesive tape DIC CORPORATION (JP) 2019-05-28 US claimed
EP-1536285-B1 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition FUJIFILM CORP (JP) 2016-01-06 EP claimed
EP-2486453-B1 POSITIVE-WORKING PHOTOIMAGEABLE BOTTOM ANTIREFLECTIVE COATING AZ ELECTRONIC MATERIALS USA (US) 2014-01-29 EP claimed
EP-1693705-B1 Positive resist composition and pattern forming method using the resist composition FUJIFILM CORP (JP) 2014-01-22 EP claimed
EP-2413195-B1 Pattern forming method FUJIFILM CORP (JP) 2013-08-28 EP claimed
EP-2486453-A1 POSITIVE-WORKING PHOTOIMAGEABLE BOTTOM ANTIREFLECTIVE COATING AZ Electronic Materials USA Corp. (US) 2012-08-15 EP claimed
US-8206886-B2 Photosensitive composition and pattern-forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2012-06-26 US claimed
US-8158326-B2 Photosensitive composition, compound for use in the photosensitive composition, and method of pattern formation with the photosensitive composition FUJIFILM CORPORATION (JP) 2012-04-17 US claimed
US-8124803-B2 Salt suitable for an acid generator and a chemically amplified resist composition containing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-02-28 US claimed
EP-2413195-A2 Pattern forming method Fujifilm Corporation (JP) 2012-02-01 EP claimed
EP-1143299-A1 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-10-10 EP claimed
EP-1128212-A2 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-08-29 EP claimed
US-20010016298-A1 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-08-23 US claimed
US-20010014428-A1 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-08-16 US claimed
EP-1122604-A2 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-08-08 EP claimed
US-6239231-B1 HAS THE POLYMERIZATION UNIT OF 2-ALKYL-2-ADAMANTYL (METH)ACRYLATE AND ONE OR BOTH OF THE POLYMERIZATION UNIT OF 3-HYDROXY-1-ADAMANTYL (METH)ACRYLATE OR (METH)ACRYLONITRILE; ACID GENERATOR; SEMICONDUCTORS SUMITOMO CHEMICAL, COMPANY LIMITED (JP) 2001-05-29 US claimed
EP-1041442-A1 Chemical amplification type positive resist SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-10-04 EP claimed
EP-1020767-A1 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-07-19 EP claimed
EP-0982628-A2 A chemical amplifying type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-03-01 EP claimed
US-6013416-A FILMS FOR PHOTORESISTS PATTERNS FUJITSU LIMITED (JP) 2000-01-11 US claimed