SCHEMBL1532318

SCHEMBL1532318

CCCC[SiH](CN)C(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4594892 0.86
SCHEMBL8849259 0.86 LMNA (0.30)
SCHEMBL1702627 0.85 DNM1 (0.37)
SCHEMBL5981608 0.74
SCHEMBL2927552 0.73
SCHEMBL3698958 0.71
SCHEMBL17995580 0.71
SCHEMBL15915213 0.66 TSHR (0.33)
SCHEMBL8849027 0.65 THRB (0.35)
SCHEMBL8848879 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3209740-A1 ADHESIVE SYSTEM WITH HIGHLY REACTIVE PRETREATMENT AGENT Sika Technology AG (CH) 2017-08-30 EP disclosed
EP-2288580-A2 AROMATIC SECONDARY ADHESIVE COMPOSITIONS CONTAINING AMINOSILANE Sika Technology AG (CH) 2011-03-02 EP disclosed
WO-2009150064-A2 AROMATIC SECONDARY ADHESIVE COMPOSITIONS CONTAINING AMINOSILANE SIKA TECHNOLOGY AG (CH) 2009-12-17 WO disclosed
EP-2094618-A1 LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION Sika Technology AG (CH) 2009-09-02 EP disclosed
WO-2008061981-A1 LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION SIKA TECHNOLOGY AG (CH) 2008-05-29 WO disclosed