SCHEMBL1554736

SCHEMBL1554736

Nc1c(O)cc(Oc2cc(O)c(N)c(O)c2)cc1O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
ESR1 P03372 1/20 0.41
ESR2 Q92731 1/20 0.41
HSP90AA1 P07900 1/20 0.37
BACE1 P56817 1/20 0.37
TUBB4A P04350 1/20 0.36
TUBB P07437 1/20 0.36
TUBA3C P0DPH7 1/20 0.36
TUBA1B P68363 1/20 0.36
TUBA4A P68366 1/20 0.36
TUBB4B P68371 1/20 0.36
TUBB3 Q13509 1/20 0.36
TUBB2A Q13885 1/20 0.36
TUBB8 Q3ZCM7 1/20 0.36
TUBA3E Q6PEY2 1/20 0.36
TUBA1A Q71U36 1/20 0.36
TUBA1C Q9BQE3 1/20 0.36
TUBB6 Q9BUF5 1/20 0.36
TUBB2B Q9BVA1 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3024410 0.78 CYP3A4 (0.61) MEN1KMT2AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL632457 0.78 BACE1 (0.47) MEN1KMT2ABACE1ALDH1A1CYP3A4
SCHEMBL1400225 0.78 CASP7 (0.47) MEN1KMT2AESR2ALDH1A1CYP3A4
SCHEMBL27510157 0.72 NR4A1 (0.56) MEN1KMT2AESR1ESR2HSP90AA1
SCHEMBL6425437 0.72 F2 (0.45) MEN1KMT2AESR1ESR2HSP90AA1
SCHEMBL5032127 0.71 HSP90AA1 (0.58) MEN1KMT2AESR1ESR2HSP90AA1
SCHEMBL11798878 0.71 CASP1 (0.43) MEN1KMT2AESR2ALDH1A1CYP3A4
SCHEMBL3126597 0.71 ALOX15 (0.48) MEN1KMT2AESR1HSP90AA1ALDH1A1
SCHEMBL10521152 0.71 CYP3A4 (0.67) MEN1KMT2AESR1ESR2HSP90AA1
SCHEMBL436522 0.70 NR4A1 (0.61) MEN1KMT2AESR1ESR2HSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9975996-B2 Positive photosensitive resin composition and polyhydroxyamide resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-05-22 US claimed
US-20160185905-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-06-30 US claimed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed
CN-119585651-A Composition for forming wavelength conversion film 日产化学株式会社 2025-03-07 CN disclosed
WO-2025047700-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF 日産化学株式会社 2025-03-06 WO disclosed
WO-2025047702-A1 COMPOSITION FOR PATTERNING AND USE OF SAME 日産化学株式会社 2025-03-06 WO disclosed
WO-2024214539-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM, AND COMPOUND 日産化学株式会社 2024-10-17 WO disclosed
CN-118525024-A Condensed ring thiophene compound and composition for forming wavelength conversion film containing same 国立大学法人东海国立大学机构 2024-08-20 CN disclosed
CN-118318191-A Composition for forming wavelength conversion film 日产化学株式会社 2024-07-09 CN disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
WO-2024122572-A1 WAVELENGTH CONVERSION FILM-FORMING COMPOSITION AND FUSED THIOPHENE COMPOUND 日産化学株式会社 2024-06-13 WO disclosed
US-20040197699-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-07 US disclosed
EP-1431822-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2004-06-23 EP disclosed
US-20040048188-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-03-11 US disclosed
US-6677099-B1 POLYAMIDEIMIDE DEVELOPED BY AN AQUEOUS ALKALINE SOLUTION AND WHICH IS EXCELLENT IN THE DEVELOPABILITY AND THE ADHESION TO A SUBSTRATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-13 US disclosed
EP-1329769-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2003-07-23 EP disclosed
EP-1241527-A1 POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2002-09-18 EP disclosed
EP-0424940-B1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL IND LTD (JP) 1998-01-14 EP disclosed
US-5288588-A Containing diamine substituted with phenolic hydroxyl, carboxyl, thiophenol and/or sulfonic groups NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1994-02-22 US disclosed
EP-0424940-A2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1991-05-02 EP disclosed