SCHEMBL15655907

SCHEMBL15655907

O=C(CCC(F)(F)C(F)(F)S(=O)(=O)O)C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.38

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 3/20 0.38
ALDH1A1 P00352 5/20 0.37
TSHR P16473 2/20 0.37
LMNA P02545 1/20 0.34
GABBR2 O75899 1/20 0.34
GABBR1 Q9UBS5 1/20 0.34
DHFR P00374 1/20 0.34
KDM4E B2RXH2 1/20 0.33
HTT P42858 1/20 0.33
HPGD P15428 1/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
ATM Q13315 1/20 0.32
HSP90AA1 P07900 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18566925 0.91 ALDH1A1 (0.38) HSD11B1ALDH1A1TSHRLMNAGABBR2
SCHEMBL20110634 0.86 HSD11B1 (0.40) HSD11B1ALDH1A1TSHRHPGD
SCHEMBL17066105 0.84 HSD11B1 (0.36) HSD11B1ALDH1A1TSHRLMNAHPGD
SCHEMBL17777176 0.83 HSD11B1 (0.38) HSD11B1ALDH1A1TSHRLMNAGABBR2
SCHEMBL16843428 0.79 HSD11B1 (0.38) HSD11B1ALDH1A1TSHRHPGD
SCHEMBL8894707 0.78 ALDH1A1 (0.40) ALDH1A1MEN1KMT2AATM
SCHEMBL4273109 0.77 ALDH1A1 (0.40) ALDH1A1MEN1KMT2AATM
SCHEMBL16140247 0.76 ALDH1A1 (0.40) ALDH1A1LMNAMEN1KMT2A
SCHEMBL22004244 0.76 LMNA (0.35) ALDH1A1TSHRLMNA
SCHEMBL9999741 0.75 ALDH1A1 (0.38) ALDH1A1MEN1KMT2AATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240210832-A1 PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-06-27 US disclosed
US-20240142874-A1 NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-05-02 US disclosed
EP-3491088-B1 OLED-COMPATIBLE ADHESIVES COMPRISING CYCLIC AZASILANE WATER SCAVENGERS TESA SE (DE) 2024-03-06 EP disclosed
US-20230146910-A1 METHODS AND COMPOSITIONS FOR IMPROVED PATTERNING OF PHOTORESIST TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-05-11 US disclosed
US-20210238342-A1 PROCESSES FOR PRODUCING VISCOUS EPOXY SYRUPS AND EPOXY SYRUPS OBTAINABLE THEREBY TESA SE (DE) 2021-08-05 US disclosed
EP-3101047-B1 METHOD FOR PRODUCING VISCOUS EPOXIDE SYRUPS AND EPOXIDE SYRUPS OBTAINABLE THEREFROM TESA SE (DE) 2020-12-30 EP disclosed
US-10876021-B2 Adhesive having water vapour barrier properties comprising incipiently polymerized epoxy syrup TESA SE (DE) 2020-12-29 US disclosed
US-10711087-B2 Processes for producing viscous epoxy syrups TESA SE (DE) 2020-07-14 US disclosed
US-20190284448-A1 Oled-Compatible Adhesives Comprising Cyclic Azasilane Water Scavengers TESA SE (DE) 2019-09-19 US disclosed
WO-2018160726-A1 LOW DIELECTRIC CONSTANT POROUS EPOXY-BASED DIELECTRIC GEORGIA TECH RESEARCH CORPORATION (US) 2018-09-07 WO disclosed
US-20160355712-A1 ADHESIVE HAVING WATER VAPOUR BARRIER PROPERTIES COMPRISING INCIPIENTLY POLYMERIZED EPOXY SYRUP TESA SE (DE) 2016-12-08 US disclosed
US-20160355634-A1 PROCESSES FOR PRODUCING VISCOUS EPOXY SYRUPS AND EPOXY SYRUPS OBTAINABLE THEREBY TESA SE (DE) 2016-12-08 US disclosed
EP-3101079-A1 STEAM BLOCKING ADHESIVE WITH ANPOLYMERISED EPOXIDE SYRUP tesa SE (DE) 2016-12-07 EP disclosed
US-20140120469-A1 THERMAL ACID GENERATORS FOR USE IN PHOTORESIST ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-05-01 US disclosed