SCHEMBL15969246

SCHEMBL15969246

CCCC(=O)ON=C(C)c1ccccc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 6/20 0.51
LMNA P02545 3/20 0.51
MAPK1 P28482 2/20 0.51
HTT P42858 1/20 0.51
MAPT P10636 2/20 0.51
PKM P14618 1/20 0.51
CDK5 Q00535 1/20 0.51
CDK5R1 Q15078 1/20 0.51
KMT2A Q03164 2/20 0.51
MEN1 O00255 1/20 0.51
TDP1 Q9NUW8 5/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
CES2 O00748 1/20 0.47
CES1 P23141 1/20 0.47
PPARA Q07869 1/20 0.47
CYP1A2 P05177 1/20 0.46
CYP2D6 P10635 1/20 0.46
HSD17B10 Q99714 1/20 0.46
HPGD P15428 1/20 0.44
RAB9A P51151 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11963937 1.00 L3MBTL1 (0.51) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL12511943 0.91 L3MBTL1 (0.56) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL11963958 0.90 KMT2A (0.58) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL14964459 0.88 TDP1 (0.55) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL11963938 0.86 L3MBTL1 (0.55) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL15969480 0.86 L3MBTL1 (0.55) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL15969657 0.85 CES2 (0.49) L3MBTL1LMNAMAPK1MAPTKMT2A
SCHEMBL14193661 0.84 LMNA (0.56) L3MBTL1LMNAMAPK1HTTMAPT
SCHEMBL14278529 0.84 CES2 (0.53) L3MBTL1LMNAMAPTKMT2AMEN1
SCHEMBL7921749 0.83 CES2 (0.56) L3MBTL1LMNAMAPTKMT2ATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025034474-A1 3D PRINTED POROUS SUPRAMOLECULAR SORBENTS BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) 2025-02-13 WO disclosed
CN-110095941-B Photosensitive resin composition and method for producing semiconductor element 东丽株式会社 2023-02-17 CN disclosed
CN-107077070-B Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device 东丽株式会社 2020-06-16 CN disclosed
EP-3203320-B9 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2020-05-06 EP disclosed
EP-3203320-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2019-10-23 EP disclosed
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
EP-2799928-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT TORAY INDUSTRIES (JP) 2019-05-22 EP disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
EP-3203320-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Toray Industries, Inc. (JP) 2017-08-09 EP disclosed
US-9704724-B2 Photosensitive resin composition and method for producing semiconductor device TORAY INDUSTRIES, INC. (JP) 2017-07-11 US disclosed
EP-2799928-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT Toray Industries, Inc. (JP) 2014-11-05 EP disclosed
US-20140242787-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2014-08-28 US disclosed