Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 1/20 | 0.49 |
| ▸ | CES1 | P23141 | 1/20 | 0.49 |
| ▸ | L3MBTL1 | Q9Y468 | 6/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.46 |
| ▸ | RAB9A | P51151 | 1/20 | 0.45 |
| ▸ | MAPT | P10636 | 3/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.44 |
| ▸ | TBXAS1 | P24557 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10903680 | 0.89 | HDAC3 (0.47) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL31174298 | 0.87 | CES2 (0.54) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL15969360 | 0.86 | ELANE (0.49) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL15969246 | 0.85 | L3MBTL1 (0.51) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL7921749 | 0.85 | CES2 (0.56) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL11963937 | 0.85 | L3MBTL1 (0.51) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL10705056 | 0.84 | PTGS2 (0.43) | L3MBTL1TDP1KMT2AALDH1A1RAB9A | |
| SCHEMBL38664774 | 0.82 | ALDH1A1 (0.46) | L3MBTL1TDP1KMT2AALDH1A1RAB9A | |
| SCHEMBL14278529 | 0.82 | CES2 (0.53) | CES2CES1L3MBTL1TDP1KMT2A | |
| SCHEMBL31174294 | 0.81 | TDP1 (0.61) | L3MBTL1TDP1KMT2AALDH1A1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025034474-A1 | 3D PRINTED POROUS SUPRAMOLECULAR SORBENTS | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) | 2025-02-13 | — | — | WO | disclosed |
| CN-115989341-A | Method for manufacturing structure with conductive pattern | 旭化成株式会社 | 2023-04-18 | — | — | CN | disclosed |
| CN-110095941-B | Photosensitive resin composition and method for producing semiconductor element | 东丽株式会社 | 2023-02-17 | — | — | CN | disclosed |
| CN-107077070-B | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | 东丽株式会社 | 2020-06-16 | — | — | CN | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| CN-110095941-A | The manufacturing method of photosensitive polymer combination and semiconductor element | 东丽株式会社 | 2019-08-06 | — | — | CN | disclosed |
| EP-2799928-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | TORAY INDUSTRIES (JP) | 2019-05-22 | — | — | EP | disclosed |
| US-20170285477-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-3203320-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-08-09 | — | — | EP | disclosed |
| US-9704724-B2 | Photosensitive resin composition and method for producing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2017-07-11 | — | — | US | disclosed |
| CN-103958465-B | Phenyl derivatives | 小野药品工业株式会社 | 2016-08-31 | — | — | CN | disclosed |
| EP-2799928-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | Toray Industries, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| US-20140242787-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2014-08-28 | — | — | US | disclosed |
| CN-104011596-A | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES | 2014-08-27 | — | — | CN | disclosed |
| CN-1289469-C | Alpha-(n-sulphonamido)acetamide derivatives as beta-amyloid inhibitors | BRISTOL MYERS SQUIBB CO (US) | 2006-12-13 | — | — | CN | disclosed |
| CN-1617852-A | Alpha- (N-sulfonamido) acetamide derivatives as beta-amyloid inhibitors | BRISTOL MYERS SQUIBB CO (US) | 2005-05-18 | — | — | CN | disclosed |