SCHEMBL1607324

SCHEMBL1607324

Cc1ccc(S(=O)(=O)O)c(CC(O)(C(=O)c2ccccc2)c2ccccc2)c1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 2/20 0.35
RECQL P46063 1/20 0.35
KIF11 P52732 1/20 0.35
KMT2A Q03164 2/20 0.34
MEN1 O00255 1/20 0.34
NPC1 O15118 1/20 0.34
RAB9A P51151 1/20 0.34
LMNA P02545 3/20 0.34
ATM Q13315 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
ALDH1A1 P00352 5/20 0.33
CES2 O00748 1/20 0.33
TP53 P04637 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
HPGD P15428 1/20 0.33
HSD17B10 Q99714 1/20 0.33
MRGPRX4 Q96LA9 1/20 0.33
MAPT P10636 1/20 0.33
DDR1 Q08345 1/20 0.33
MEP1B Q16820 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4056325 0.78 LMNA (0.36) CES1RECQLKIF11KMT2AMEN1
SCHEMBL6851739 0.76 RECQL (0.47) CES1RECQLKMT2AMEN1NPC1
SCHEMBL8960774 0.76 ALDH1A1 (0.39) RECQLKMT2AMEN1ATML3MBTL1
SCHEMBL658696 0.75 GAA (0.39) RECQLKMT2AMEN1LMNAL3MBTL1
SCHEMBL7627786 0.75 MEN1 (0.39) RECQLKMT2AMEN1LMNAL3MBTL1
SCHEMBL30667161 0.75 MEN1 (0.39) RECQLKMT2AMEN1LMNAL3MBTL1
SCHEMBL6391457 0.74 HPGD (0.47) CES1KMT2AMEN1LMNAALDH1A1
SCHEMBL6391460 0.74 LMNA (0.47) CES1KIF11KMT2AMEN1NPC1
SCHEMBL504244 0.73 RECQL (0.47) CES1RECQLKMT2AMEN1NPC1
SCHEMBL8380602 0.72 ALDH1A1 (0.40) RECQLKMT2AMEN1L3MBTL1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8795951-B2 Material for forming resist sensitization film and production method of semiconductor device FUJITSU LIMITED (JP) 2014-08-05 US disclosed
US-20110081615-A1 MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-04-07 US disclosed
US-20090130419-A1 FOAM SHEET AND PRODUCTION PROCESS THEREOF OJI PAPER CO., LTD (JP) 2009-05-21 US disclosed
US-20080070998-A1 Foam Production Method OJI PAPER CO., LTD. (JP) 2008-03-20 US disclosed
EP-1795553-A1 PROCESS FOR PRODUCING FOAM Oji Paper Co., Ltd. (JP) 2007-06-13 EP disclosed
US-20060210785-A1 Foamed product in a sheet form and method for production thereof OJI PAPER CO., LTD. (JP) 2006-09-21 US disclosed
EP-1647570-A1 FOAMED PRODUCT IN A SHEET FORM AND METHOD FOR PRODUCTION THEREOF Oji Paper Co., Ltd. (JP) 2006-04-19 EP disclosed
US-6569596-B1 Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-05-27 US disclosed