Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.53 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.47 |
| ▸ | NPC1 | O15118 | 2/20 | 0.45 |
| ▸ | RAB9A | P51151 | 2/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.45 |
| ▸ | PPARG | P37231 | 2/20 | 0.45 |
| ▸ | PPARA | Q07869 | 1/20 | 0.45 |
| ▸ | MAOB | P27338 | 2/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.43 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.43 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.42 |
| ▸ | CA1 | P00915 | 1/20 | 0.42 |
| ▸ | CA2 | P00918 | 1/20 | 0.42 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.42 |
| ▸ | BRD4 | O60885 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9900542 | 1.00 | ALDH1A1 (0.53) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL1629179 | 1.00 | ALDH1A1 (0.53) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL934853 | 0.89 | ALOX5 (0.56) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL934854 | 0.89 | ALOX5 (0.56) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL2047154 | 0.88 | NPC1 (0.50) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL2047156 | 0.88 | NPC1 (0.50) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL408659 | 0.86 | ALDH1A1 (0.50) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL408656 | 0.86 | ALDH1A1 (0.50) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL9898660 | 0.84 | ALDH1A1 (0.49) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 | |
| SCHEMBL2863838 | 0.84 | NPC1 (0.49) | ALDH1A1ALOX5NPC1RAB9AL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8748531-B2 | Polymers functionalized with oxime compounds containing an acyl group | BRIDGESTONE CORPORATION (JP) | 2014-06-10 | — | — | US | claimed |
| EP-2649102-A1 | POLYMERS FUNCTIONALIZED WITH OXIME COMPOUNDS CONTAINING AN ACYL GROUP | Bridgestone Corporation (JP) | 2013-10-16 | — | — | EP | claimed |
| US-20120149833-A1 | POLYMERS FUNCTIONALIZED WITH OXIME COMPOUNDS CONTAINING AN ACYL GROUP | BRIDGESTONE CORPORATION (JP) | 2012-06-14 | — | — | US | claimed |
| WO-2012078962-A1 | POLYMERS FUNCTIONALIZED WITH OXIME COMPOUNDS CONTAINING AN ACYL GROUP | BRIDGESTONE CORPORATION (JP) | 2012-06-14 | — | — | WO | claimed |
| EP-0377321-B1 | Photopolymerizable composition | FUJI PHOTO FILM CO LTD (JP) | 1995-03-22 | — | — | EP | claimed |
| EP-3633455-B1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-04-08 | — | — | EP | disclosed |
| EP-3859447-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-11-19 | — | — | EP | disclosed |
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-20230391957-A1 | PHOTOCURABLE BLACK SILICONE COMPOSITION AND CURED PRODUCT THEREOF | DUROPTIX MATERIALS KABUSHIKI KAISHA (JP) | 2023-12-07 | — | — | US | disclosed |
| CN-117165089-A | Photocurable black silicone composition and cured product thereof | 罗门哈斯电子材料韩国有限公司 | 2023-12-05 | — | — | CN | disclosed |
| US-11567405-B2 | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-01-31 | — | — | US | disclosed |
| EP-3859447-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2021-08-04 | — | — | EP | disclosed |
| EP-1839853-B1 | Planographic printing plate precursor and stack thereof | FUJIFILM CORP (JP) | 2009-07-08 | — | — | EP | disclosed |
| US-20090123642-A1 | EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD | FUJIFILM CORPORATION (JP) | 2009-05-14 | — | — | US | disclosed |
| US-20070246249-A1 | Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same | FUJI PHOTO FILM CO., LTD. (JP) | 2007-10-25 | — | — | US | disclosed |
| US-20070231740-A1 | A planographic printing plate precursor comprising: an aluminum support; and a photosensitive layer including a polymerization initiator, a polymerizable compound and a binder polymer; an oxygen barrier layer; and a protective layer including a filler; capable of image formation | FUJIFILM CORPORATION (JP) | 2007-10-04 | — | — | US | disclosed |
| EP-1839853-A1 | Planographic printing plate precursor and stack thereof | FUJIFILM Corporation (JP) | 2007-10-03 | — | — | EP | disclosed |
| WO-2007052846-A1 | EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD | FUJIFILM CORPORATION (JP) | 2007-05-10 | — | — | WO | disclosed |
| EP-1698218-A1 | METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME | FUJI PHOTO FILM CO., LTD. (JP) | 2006-09-06 | — | — | EP | disclosed |
| WO-2005053368-A1 | METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME | FUJI PHOTO FILM CO., LTD. (JP) | 2005-06-09 | — | — | WO | disclosed |