SCHEMBL16610475

SCHEMBL16610475

NCn1nnc2c(C(=O)O)cccc21

nearest known ligand 0.40

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
GRM2 Q14416 9/20 0.40
ALDH1A1 P00352 1/20 0.39
EGLN3 Q9H6Z9 1/20 0.38
MGAM O43451 3/20 0.38
AMY1A P0DUB6 3/20 0.38
GAA P10253 3/20 0.38
SI P14410 3/20 0.38
MGAM2 Q2M2H8 3/20 0.38
HMGB1 P09429 1/20 0.37
HPGD P15428 2/20 0.37
RAB9A P51151 1/20 0.37
KDM4E B2RXH2 1/20 0.36
MAOA P21397 1/20 0.36
MAOB P27338 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28411473 0.80 GRM2 (0.62) GRM2ALDH1A1EGLN3
SCHEMBL11490926 0.77 GRM2 (0.56) GRM2ALDH1A1
SCHEMBL15517000 0.77 GRM2 (0.35) GRM2ALDH1A1EGLN3MGAMAMY1A
SCHEMBL724308 0.77 MAPK1 (0.51) ALDH1A1HPGDRAB9AKDM4E
SCHEMBL10347831 0.76 ALDH1A1 (0.42) ALDH1A1HPGDRAB9AKDM4E
SCHEMBL11022153 0.76 ALDH1A1 (0.42) ALDH1A1HPGDRAB9AKDM4E
SCHEMBL30622603 0.76 HCAR3 (0.45) ALDH1A1MGAMAMY1AGAASI
SCHEMBL2012449 0.76 HCAR3 (0.45) ALDH1A1MGAMAMY1AGAASI
SCHEMBL9138969 0.76 PTGES (0.49) GRM2ALDH1A1GAAHPGDKDM4E
SCHEMBL2857242 0.74 GRM2 (0.39) GRM2ALDH1A1MGAMAMY1AGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9110371-B2 Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing wiring board HITACHI CHEMICAL COMPANY, LTD (JP) 2015-08-18 US disclosed
US-20150153647-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING WIRING BOARD RESONAC CORPORATION (JP) 2015-06-04 US disclosed
EP-2857899-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING WIRING BOARD Hitachi Chemical Company, Ltd. (JP) 2015-04-08 EP disclosed