SCHEMBL16752107

SCHEMBL16752107

CC(Sc1ccc(O)cc1)C(=O)c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADORA2A P29274 1/20 0.48
ADORA1 P30542 1/20 0.48
CES2 O00748 2/20 0.46
LMNA P02545 7/20 0.45
HSD17B10 Q99714 1/20 0.45
MEN1 O00255 2/20 0.42
MAPT P10636 2/20 0.42
KMT2A Q03164 2/20 0.42
RAB9A P51151 1/20 0.42
EPHX1 P07099 1/20 0.41
PGR P06401 1/20 0.41
ADRA2A P08913 1/20 0.41
ADRA2B P18089 1/20 0.41
HTR2A P28223 1/20 0.41
HRH1 P35367 1/20 0.41
KCNH2 Q12809 1/20 0.41
CYP2D6 P10635 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
L3MBTL1 Q9Y468 3/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10779384 0.89 ADORA2A (0.53) ADORA2AADORA1CES2LMNAHSD17B10
SCHEMBL28618718 0.83 LMNA (0.43) ADORA2AADORA1CES2LMNAHSD17B10
SCHEMBL10455020 0.80 KDM4E (0.47) LMNAHSD17B10EPHX1CYP2D6CYP2C9
SCHEMBL10455022 0.80 KDM4E (0.47) LMNAHSD17B10EPHX1CYP2D6CYP2C9
SCHEMBL28496338 0.79 SMN1; SMN2 (0.51) ADORA2AADORA1CES2LMNAMEN1
SCHEMBL9840266 0.77 NR1H2 (0.42) LMNAHSD17B10EPHX1CYP2D6CYP2C9
SCHEMBL7867720 0.76 CES2 (0.59) CES2LMNAHSD17B10MEN1MAPT
Phenol SCHEMBL14718671 0.74 CES2 (0.50) CES2LMNAHSD17B10MEN1MAPT
SCHEMBL10776096 0.74 PGR (0.48) ADORA2AADORA1CES2LMNAMEN1
SCHEMBL9541003 0.73 LMNA (0.53) CES2LMNAHSD17B10MEN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021065796-A1 CURABLE COMPOSITION, CURED MATERIAL, AND METHOD FOR FORMING CURED MATERIAL 東京応化工業株式会社 2021-04-08 WO disclosed
US-10273389-B2 Resin composition DENKA COMPANY LIMITED (JP) 2019-04-30 US disclosed
US-20150210905-A1 RESIN COMPOSITION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2015-07-30 US disclosed
EP-2878611-A1 RESIN COMPOSITION Denki Kagaku Kogyo Kabushiki Kaisha (JP) 2015-06-03 EP disclosed