SCHEMBL170540

SCHEMBL170540

NC(=O)CCCCC(=O)N1Cc2cccc(c2)C1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.41
MAPT P10636 2/20 0.41
NPSR1 Q6W5P4 1/20 0.41
HDAC3 O15379 1/20 0.39
HDAC1 Q13547 1/20 0.39
HDAC10 Q969S8 1/20 0.39
HDAC11 Q96DB2 1/20 0.39
TPSAB1 Q15661 3/20 0.37
TPSD1 Q9BZJ3 3/20 0.37
TPSG1 Q9NRR2 3/20 0.37
TSHR P16473 3/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
KDM4E B2RXH2 1/20 0.37
ALDH1A1 P00352 1/20 0.37
HTR1A P08908 1/20 0.36
HTR7 P34969 1/20 0.36
NAMPT P43490 1/20 0.35
F2 P00734 1/20 0.35
HPGD P15428 2/20 0.35
NPC1 O15118 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28392745 0.98 HDAC3 (0.41) LMNAMAPTNPSR1HDAC3HDAC1
SCHEMBL28397359 0.98 HDAC3 (0.41) LMNAMAPTNPSR1HDAC3HDAC1
SCHEMBL8962572 0.97 LMNA (0.40) LMNAMAPTNPSR1HDAC3HDAC1
SCHEMBL28528392 0.92 ALDH1A1 (0.39) LMNAMAPTNPSR1SMN1; SMN2KDM4E
SCHEMBL4439473 0.91 HDAC3 (0.37) LMNAMAPTNPSR1HDAC3HDAC1
SCHEMBL4560033 0.91 MEN1 (0.43) LMNAMAPTNPSR1TSHRMEN1
SCHEMBL8518592 0.87 ALDH1A1 (0.49) LMNAMAPTNPSR1HDAC3HDAC1
SCHEMBL2445561 0.87 MEN1 (0.40) LMNAMAPTTSHRSMN1; SMN2KDM4E
SCHEMBL170857 0.86 LMNA (0.42) LMNAMAPTNPSR1HDAC3HDAC1
SCHEMBL17351915 0.84 L3MBTL1 (0.49) LMNAMAPTALDH1A1NAMPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3301 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256026-A Anti-aging composition, high-temperature-resistant polyamide compound and preparation method thereof 天津利安隆新材料股份有限公司 2024-06-28 CN claimed
US-11999094-B2 Biaxially oriented polyamide film and polyamide film mill roll TOYOBO CO., LTD. (JP) 2024-06-04 US claimed
CN-118006118-A Halogen-free flame-retardant biaxially oriented nylon film and preparation method thereof 昆山运城塑业有限公司 2024-05-10 CN claimed
CN-220913371-U Multilayer coextrusion quantum dot diffusion plate and melt extrusion structure thereof 致晶科技(北京)有限公司 2024-05-07 CN claimed
WO-2024084338-A1 SCAVENGING OXYGEN COLORMATRIX HOLDINGS, INC. (US) 2024-04-25 WO claimed
CN-117881538-A Biaxially stretched polyamide film and packaging material 东洋纺株式会社 2024-04-12 CN claimed
US-20240093181-A1 METHODS FOR ISOLATING AND/OR OBTAINING CAPTURED POLYNUCLEOTIDE FRAGMENTS JANN COSIMO (DE) 2024-03-21 US claimed
CN-117720810-A Glass fiber reinforced polyamide composite material and preparation method thereof 中化工程塑料(扬州)有限公司 2024-03-19 CN claimed
EP-4334442-A1 METHODS FOR ISOLATING AND/OR OBTAINING CAPTURED POLYNUCLEOTIDE FRAGMENTS European Molecular Biology Laboratory (DE) 2024-03-13 EP claimed
EP-3884013-B1 DIRECT CONVERSION OF PLASTIC MATERIALS INTO METHANE AND/OR LIQUID FUELS ECOLE POLYTECHNIQUE FED LAUSANNE EPFL (CH) 2024-01-10 EP claimed
EP-0535266-B1 Evacuated container for collecting blood NISSHO KK (JP) 1994-08-10 EP claimed
EP-0605583-A1 TOUGH POLY(META-XYLYLENE ADIPAMIDE) WITH HIGH FLEXURAL MODULUS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1994-07-13 EP claimed
US-5268219-A M-xylylene adipamide MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1993-12-07 US claimed
US-5266413-A Packaging EASTMAN KODAK COMPANY (US) 1993-11-30 US claimed
WO-1993023474-A1 COPOLYESTER/POLYAMIDE BLEND HAVING IMPROVED FLAVOR RETAINING PROPERTY AND CLARITY EASTMAN CHEMICAL COMPANY (US) 1993-11-25 WO claimed
US-5258233-A Gas barrier; improved food storage EASTMAN KODAK COMPANY (US) 1993-11-02 US claimed
WO-1993020147-A1 POLYESTER/POLYAMIDE BLEND HAVING IMPROVED FLAVOR RETAINING PROPERTY AND CLARITY EASTMAN CHEMICAL COMPANY (US) 1993-10-14 WO claimed
EP-0331975-B1 THERMOPLASTIC RESIN COMPOSITION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1993-05-05 EP claimed
WO-1993006176-A1 TOUGH POLY(META-XYLYLENE ADIPAMIDE) WITH HIGH FLEXURAL MODULUS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1993-04-01 WO claimed
EP-0475720-A2 Polyamide resin composition and film therefrom MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1992-03-18 EP claimed