SCHEMBL1713009

SCHEMBL1713009

O=C(O)c1cccc(C(=O)O)c1C#Cc1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HNF4A P41235 1/20 0.55
ALDH1A1 P00352 3/20 0.52
ALOX15 P16050 1/20 0.52
NPC1 O15118 1/20 0.52
RAB9A P51151 1/20 0.52
AKR1C2 P52895 1/20 0.50
AKR1C1 Q04828 1/20 0.50
APP P05067 1/20 0.50
FFAR1 O14842 4/20 0.46
PTPN11 Q06124 2/20 0.46
NPSR1 Q6W5P4 1/20 0.46
PTPRC P08575 1/20 0.46
PTPN2 P17706 1/20 0.46
PTPN1 P18031 1/20 0.46
PTPN6 P29350 1/20 0.46
PTPN9 P43378 1/20 0.46
DUSP3 P51452 1/20 0.46
PTPN22 Q9Y2R2 1/20 0.46
NR4A1 P22736 1/20 0.45
NR4A2 P43354 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5667352 0.90 HNF4A (0.50) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL5668837 0.89 HNF4A (0.49) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL5669133 0.86 HNF4A (0.50) HNF4AAKR1C2AKR1C1PTPN11PTPRC
SCHEMBL5667269 0.84 NR4A1 (0.49) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL5669586 0.83 HNF4A (0.44) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL17746893 0.82 HNF4A (0.54) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL2745848 0.81 MMP2 (0.43) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL26133015 0.80 HNF4A (0.47) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL2256468 0.79 NPC1 (0.72) HNF4AALDH1A1ALOX15NPC1RAB9A
SCHEMBL29479413 0.79 NPC1 (0.72) HNF4AALDH1A1ALOX15NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2344568-B1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2017-12-20 EP claimed
US-8492507-B2 Acetylenic polyamide NEXAM CHEMICAL AB (SE) 2013-07-23 US claimed
US-20110190469-A1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2011-08-04 US claimed
EP-2344568-A1 ACETYLENIC POLYAMIDE Nexam Chemical AB (SE) 2011-07-20 EP claimed
WO-2010036170-A1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2010-04-01 WO claimed
WO-2010030216-A1 ACETYLENIC POLY(ALKYLENE PHTHALATE) NEXAM CHEMICAL AB (SE) 2010-03-18 WO claimed
CN-115197565-B Semi-crystalline polyamide composition based on short diamines with high glass transition temperature, process for its production and use thereof 阿科玛法国公司 2024-10-11 CN disclosed
CN-115197565-A Semi-crystalline polyamide composition based on short diamines with high glass transition temperature, method for the production thereof and use thereof 阿科玛法国公司 2022-10-18 CN disclosed
CN-110446740-B Semi-crystalline polyamide compositions based on short diamines with high glass transition temperature, method for the production thereof and use thereof 阿科玛法国公司 2022-07-12 CN disclosed
CN-110431169-B Semi-crystalline polyamide composition having a high glass transition temperature and a high melting temperature, method for preparing same and use thereof 阿科玛法国公司 2022-05-17 CN disclosed
CN-108026267-B Semi-crystalline polyamide composition with high glass transition temperature for thermoplastic materials, method for the production thereof and use thereof 阿科玛法国公司 2021-02-02 CN disclosed
CN-107949596-B Semi-crystalline polyamide component with high glass transition temperature for composite materials, method for the production thereof and use thereof 阿科玛法国公司 2021-02-02 CN disclosed
EP-2344568-B1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2017-12-20 EP disclosed
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed